Reliability of printed power resistor with thick-film copper terminals

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F19%3A43955541" target="_blank" >RIV/49777513:23220/19:43955541 - isvavai.cz</a>

Výsledek na webu

<a href="https://www.sciencedirect.com/science/article/pii/S0167931719302515" target="_blank" >https://www.sciencedirect.com/science/article/pii/S0167931719302515</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1016/j.mee.2019.111095" target="_blank" >10.1016/j.mee.2019.111095</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Reliability of printed power resistor with thick-film copper terminals

Popis výsledku v původním jazyce

This paper is focused on the thick-film power resistors with copper terminals. These terminals are created by the new Thick Printed Copper (TPC) technology. This technology is based on sequential screen printing and firing of copper paste in nitrogen atmosphere on an alumina substrate. Thick-film power resistor with copper terminals represents a potential replacement of standard wirewound power resistors and allows the direct integration of resistors on TPC substrates. Printed resistors on TPC substrates can be supplemented with discrete electronic components which creates the possibility to realize really complex power electronic circuits. The direct integration of printed components is not possible in case of using the standard Direct Bonded Copper (DBC) technology. The main benefits of printed resistors based on TPC technology are their low thickness and good thermal conductivity. The low thickness of resistors is important for miniaturization of final electronic devices. The resistor main electrical parameters as the temperature coefficient of resistance, temperature coefficient and nominal resistance value after dry heat aging and after thermal cycling, insulation resistance, dielectric strength etc., are described in this paper.

Název v anglickém jazyce

Reliability of printed power resistor with thick-film copper terminals

Popis výsledku anglicky

This paper is focused on the thick-film power resistors with copper terminals. These terminals are created by the new Thick Printed Copper (TPC) technology. This technology is based on sequential screen printing and firing of copper paste in nitrogen atmosphere on an alumina substrate. Thick-film power resistor with copper terminals represents a potential replacement of standard wirewound power resistors and allows the direct integration of resistors on TPC substrates. Printed resistors on TPC substrates can be supplemented with discrete electronic components which creates the possibility to realize really complex power electronic circuits. The direct integration of printed components is not possible in case of using the standard Direct Bonded Copper (DBC) technology. The main benefits of printed resistors based on TPC technology are their low thickness and good thermal conductivity. The low thickness of resistors is important for miniaturization of final electronic devices. The resistor main electrical parameters as the temperature coefficient of resistance, temperature coefficient and nominal resistance value after dry heat aging and after thermal cycling, insulation resistance, dielectric strength etc., are described in this paper.

Druh

J_imp - Článek v periodiku v databázi Web of Science

CEP obor

—

OECD FORD obor

20201 - Electrical and electronic engineering

Projekt

<a href="/cs/project/EF18_069%2F0009855" target="_blank" >EF18_069/0009855: Elektrotechnické technologie s vysokým podílem vestavěné inteligence</a><br>

Návaznosti

P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>S - Specificky vyzkum na vysokych skolach<br>I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Rok uplatnění

2019

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název periodika

Microelectronic Engineering

ISSN

0167-9317

e-ISSN

—

Svazek periodika

216

Číslo periodika v rámci svazku

August 2019

Stát vydavatele periodika

NL - Nizozemsko

Počet stran výsledku

8

Strana od-do

1-8

Kód UT WoS článku

000487764900020

EID výsledku v databázi Scopus

2-s2.0-85069660775