Thick film power resistor with thick printed copper terminals

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F17%3A43932349" target="_blank" >RIV/49777513:23220/17:43932349 - isvavai.cz</a>

Výsledek na webu

<a href="http://passive-components.eu/thick-film-power-resistor-with-thick-printed-copper-terminals/" target="_blank" >http://passive-components.eu/thick-film-power-resistor-with-thick-printed-copper-terminals/</a>

DOI - Digital Object Identifier

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Jazyk výsledku

angličtina

Název v původním jazyce

Thick film power resistor with thick printed copper terminals

Popis výsledku v původním jazyce

This paper is focused on the thick film power resistors with copper terminals. These terminals are manufactured by the new Thick Printed Copper (TPC) technology. This technology is based on sequential screen printing and firing of copper paste in nitrogen atmosphere on alumina substrate. TPC technology is predominantly used for power electronic substrates manufacturing. Themajor trends of power electronics are continual miniaturization and power increasing. Itbrings increased requirements on electronic components particularly in terms of heat dissipation. Thick film power resistor with copper terminals represents potential replacement of standard wirewound power resistors and allows direct integration of resistors on TPC substrates. Printed resistors on TPC substrates can be supplemented with discrete electronic components which creates the possibility to realize truly complex power electronic circuits. The direct integration of printed components is not possible in case of standard Direct Bonded Copper (DBC) technology. The main benefits of printed resistors based on TPC technology are its low thickness and good therrnaí conductivity. The low thickness of resistors is important for miniaturization of final electronic devices. The resistor main electrical parameters (temperature coefficient of resistance, temperature coefficient and nominal resistance value affer aging by dry heat test, insulation resistance, dielectric strength etc.) are described in this paper.

Název v anglickém jazyce

Thick film power resistor with thick printed copper terminals

Popis výsledku anglicky

This paper is focused on the thick film power resistors with copper terminals. These terminals are manufactured by the new Thick Printed Copper (TPC) technology. This technology is based on sequential screen printing and firing of copper paste in nitrogen atmosphere on alumina substrate. TPC technology is predominantly used for power electronic substrates manufacturing. Themajor trends of power electronics are continual miniaturization and power increasing. Itbrings increased requirements on electronic components particularly in terms of heat dissipation. Thick film power resistor with copper terminals represents potential replacement of standard wirewound power resistors and allows direct integration of resistors on TPC substrates. Printed resistors on TPC substrates can be supplemented with discrete electronic components which creates the possibility to realize truly complex power electronic circuits. The direct integration of printed components is not possible in case of standard Direct Bonded Copper (DBC) technology. The main benefits of printed resistors based on TPC technology are its low thickness and good therrnaí conductivity. The low thickness of resistors is important for miniaturization of final electronic devices. The resistor main electrical parameters (temperature coefficient of resistance, temperature coefficient and nominal resistance value affer aging by dry heat test, insulation resistance, dielectric strength etc.) are described in this paper.

Druh

D - Stať ve sborníku

CEP obor

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OECD FORD obor

20201 - Electrical and electronic engineering

Projekt

Výsledek vznikl pri realizaci vícero projektů. Více informací v záložce Projekty.

Návaznosti

P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)

Rok uplatnění

2017

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

PCNS Passive Components Networking Days Proceedings

ISBN

978-80-905768-8-9

ISSN

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e-ISSN

neuvedeno

Počet stran výsledku

5

Strana od-do

137-141

Název nakladatele

Vysoké učení technické v Brně

Místo vydání

Brno

Místo konání akce

Brno, Czech Republic

Datum konání akce

12. 9. 2017

Typ akce podle státní příslušnosti

EUR - Evropská akce

Kód UT WoS článku

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