Electromigration and Flux Residues

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F21%3APU142452" target="_blank" >RIV/00216305:26220/21:PU142452 - isvavai.cz</a>

Výsledek na webu

<a href="https://iopscience.iop.org/article/10.1149/10501.0401ecst/meta" target="_blank" >https://iopscience.iop.org/article/10.1149/10501.0401ecst/meta</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1149/10501.0401ecst" target="_blank" >10.1149/10501.0401ecst</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Electromigration and Flux Residues

Popis výsledku v původním jazyce

Electromigration and its subcategory electrochemical migration is a serious problem in electronic industry working with printed circuit boards (PCB). Smaller equipment with high density of interconnection (HDI) is assembled with surface mounted devices (SMD) and through hole components (THC) Assembly techniques are realised mainly by soldering process with no clean fluxes. Result is not only a reliable solder joint, but also flux residues. The first part of the article after short theory is focused on gatering basic knowledge about fluxes and surface finishes by using cyclic voltammetry (CV) and electrochemical impedance spectrometry (EIS). The second part of the experiments is oriented on practical test with different fluxes for wave and reflow soldering. These tests are associated with the reduction of surface insulation resistance, corrosion, dendrite/fiber growth and the formation of subsequent short circuits. The acceleration of these electrochemical reactions is helped by higher working temperatures, higher humidity, and magnitude and frequency of electrical voltage between the conductors.

Název v anglickém jazyce

Electromigration and Flux Residues

Popis výsledku anglicky

Electromigration and its subcategory electrochemical migration is a serious problem in electronic industry working with printed circuit boards (PCB). Smaller equipment with high density of interconnection (HDI) is assembled with surface mounted devices (SMD) and through hole components (THC) Assembly techniques are realised mainly by soldering process with no clean fluxes. Result is not only a reliable solder joint, but also flux residues. The first part of the article after short theory is focused on gatering basic knowledge about fluxes and surface finishes by using cyclic voltammetry (CV) and electrochemical impedance spectrometry (EIS). The second part of the experiments is oriented on practical test with different fluxes for wave and reflow soldering. These tests are associated with the reduction of surface insulation resistance, corrosion, dendrite/fiber growth and the formation of subsequent short circuits. The acceleration of these electrochemical reactions is helped by higher working temperatures, higher humidity, and magnitude and frequency of electrical voltage between the conductors.

Druh

D - Stať ve sborníku

CEP obor

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OECD FORD obor

20201 - Electrical and electronic engineering

Projekt

—

Návaznosti

S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2021

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

Advanced Batteries Accumulators and Fuel Cells – 22nd ABAF

ISBN

978-80-214-5975-5

ISSN

1938-5862

e-ISSN

1938-6737

Počet stran výsledku

9

Strana od-do

401-409

Název nakladatele

Electrochemical Society

Místo vydání

neuveden

Místo konání akce

Brno

Datum konání akce

22. 8. 2021

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

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