Influence of Solder Mask on Electrochemical Migration on Printed Circuit Boards

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F24%3A00376493" target="_blank" >RIV/68407700:21230/24:00376493 - isvavai.cz</a>

Výsledek na webu

<a href="https://doi.org/10.3390/ma17174242" target="_blank" >https://doi.org/10.3390/ma17174242</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.3390/ma17174242" target="_blank" >10.3390/ma17174242</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Influence of Solder Mask on Electrochemical Migration on Printed Circuit Boards

Popis výsledku v původním jazyce

Electrochemical migration (ECM) on the surface of printed circuit boards (PCBs) continues to pose a significant reliability risk in electronics. Nevertheless, the existing literature lacks studies that address the solder mask and solder pad design aspects in the context of ECM. Therefore, the objective of this study was to assess the impact of solder mask type with varying roughness and solder pad design on the susceptibility to ECM using a water drop test and thermal humidity bias test. Hot air solder leveling-coated PCBs were tested. Furthermore, the ECM tests were conducted on PCBs with applied no-clean solder paste to evaluate the influence of flux residues on the resulting ECM behavior. The results indicated that the higher roughness of the solder mask significantly contributes to ECM inhibition through the creation of a mechanical barrier for the dendrites. Furthermore, lower ECM susceptibility was also observed for copper-defined pads, where a similar effect is presumed. However, the influence of the no-clean flux residues can prevail over the effects of the solder mask. Therefore, the use of a rough solder mask and a copper-defined pad design is recommended if the PCB is to be washed from flux residues after the soldering process.

Název v anglickém jazyce

Influence of Solder Mask on Electrochemical Migration on Printed Circuit Boards

Popis výsledku anglicky

Electrochemical migration (ECM) on the surface of printed circuit boards (PCBs) continues to pose a significant reliability risk in electronics. Nevertheless, the existing literature lacks studies that address the solder mask and solder pad design aspects in the context of ECM. Therefore, the objective of this study was to assess the impact of solder mask type with varying roughness and solder pad design on the susceptibility to ECM using a water drop test and thermal humidity bias test. Hot air solder leveling-coated PCBs were tested. Furthermore, the ECM tests were conducted on PCBs with applied no-clean solder paste to evaluate the influence of flux residues on the resulting ECM behavior. The results indicated that the higher roughness of the solder mask significantly contributes to ECM inhibition through the creation of a mechanical barrier for the dendrites. Furthermore, lower ECM susceptibility was also observed for copper-defined pads, where a similar effect is presumed. However, the influence of the no-clean flux residues can prevail over the effects of the solder mask. Therefore, the use of a rough solder mask and a copper-defined pad design is recommended if the PCB is to be washed from flux residues after the soldering process.

Druh

J_imp - Článek v periodiku v databázi Web of Science

CEP obor

—

OECD FORD obor

20201 - Electrical and electronic engineering

Projekt

—

Návaznosti

S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2024

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název periodika

Materials

ISSN

1996-1944

e-ISSN

1996-1944

Svazek periodika

17

Číslo periodika v rámci svazku

17

Stát vydavatele periodika

CH - Švýcarská konfederace

Počet stran výsledku

19

Strana od-do

1-19

Kód UT WoS článku

001310950200001

EID výsledku v databázi Scopus

2-s2.0-85203661943