Temperature Stabilized Chip Expander

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26230%2F15%3APU117008" target="_blank" >RIV/00216305:26230/15:PU117008 - isvavai.cz</a>

Výsledek na webu

<a href="http://dx.doi.org/10.13140/RG.2.1.1154.4084" target="_blank" >http://dx.doi.org/10.13140/RG.2.1.1154.4084</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.13140/RG.2.1.1154.4084" target="_blank" >10.13140/RG.2.1.1154.4084</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Temperature Stabilized Chip Expander

Popis výsledku v původním jazyce

For measurements and testing of experimental semiconductor structures there raises a problem with the connection between the chip and the measuring circuit. Our proposed chip expander provides the function of the carrier substrate (Al2O3) with CTE compatibility to experimental silicon chip. It also allows expansion of terminals chip into a larger area. Interconnection between the chip and the conductive topology realized on a carrier substrate is realized by wire bonding (gold wire or AlSi1 form with diameter 17.5 up to 75 microns). Test measurement system is connected either the standard soldered pins or through precision gold plated SIP socket pins. Very flat planar configuration of the chip expander allows you to work in very small chambers such as the AFM microscopes, etc. Another significant advantage of expander chip is also the possibility of its own temperature stabilization through the heating element located on the reverse side. This chip expander is thanks to its CTE and possibilities of flexible leads (gull-wing) can also be used as an adapter for mounting of large semiconductor chips into ordinary test boards (FR4). The article discusses the use of chip expanders in the context of polymorphic chips experiments. In this case chip expander with mounted polymorphic chip are thermally stabilized at a temperature range from ambient temperature to 120 ° C. Polymorphic circuits can be considered as multifunctional circuits that change of their behavior comes from modifications in the characteristic of components involved in the circuit in response to controls temperature.

Název v anglickém jazyce

Temperature Stabilized Chip Expander

Popis výsledku anglicky

For measurements and testing of experimental semiconductor structures there raises a problem with the connection between the chip and the measuring circuit. Our proposed chip expander provides the function of the carrier substrate (Al2O3) with CTE compatibility to experimental silicon chip. It also allows expansion of terminals chip into a larger area. Interconnection between the chip and the conductive topology realized on a carrier substrate is realized by wire bonding (gold wire or AlSi1 form with diameter 17.5 up to 75 microns). Test measurement system is connected either the standard soldered pins or through precision gold plated SIP socket pins. Very flat planar configuration of the chip expander allows you to work in very small chambers such as the AFM microscopes, etc. Another significant advantage of expander chip is also the possibility of its own temperature stabilization through the heating element located on the reverse side. This chip expander is thanks to its CTE and possibilities of flexible leads (gull-wing) can also be used as an adapter for mounting of large semiconductor chips into ordinary test boards (FR4). The article discusses the use of chip expanders in the context of polymorphic chips experiments. In this case chip expander with mounted polymorphic chip are thermally stabilized at a temperature range from ambient temperature to 120 ° C. Polymorphic circuits can be considered as multifunctional circuits that change of their behavior comes from modifications in the characteristic of components involved in the circuit in response to controls temperature.

Druh

D - Stať ve sborníku

CEP obor

—

OECD FORD obor

20206 - Computer hardware and architecture

Projekt

<a href="/cs/project/LD14055" target="_blank" >LD14055: Nekonvenční návrhové techniky pro číslicové obvody s vlastní rekonfigurací: od materiálů k implementaci</a><br>

Návaznosti

P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)

Rok uplatnění

2015

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

Proceedings on 20th European Microelectronics and Packaging Conference & Exhibition

ISBN

978-0-9568086-1-5

ISSN

—

e-ISSN

—

Počet stran výsledku

6

Strana od-do

1-6

Název nakladatele

IMAPS-Deutschland e.V.

Místo vydání

Friedrichshafen

Místo konání akce

Friedrichshafen

Datum konání akce

14. 9. 2015

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

000380428600016