Reconfigurable Digital Circuits Based on Chip Expander with Integrated Temperature Regulation

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26230%2F15%3APU117073" target="_blank" >RIV/00216305:26230/15:PU117073 - isvavai.cz</a>

Výsledek na webu

<a href="http://www.scirp.org/journal/PaperDownload.aspx?paperID=61318" target="_blank" >http://www.scirp.org/journal/PaperDownload.aspx?paperID=61318</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.4236/jcc.2015.311027" target="_blank" >10.4236/jcc.2015.311027</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Reconfigurable Digital Circuits Based on Chip Expander with Integrated Temperature Regulation

Popis výsledku v původním jazyce

This article is dealing with a development of custom chip expander platform with the possibility of accurate temperature control and integration of additional silicon-based features. Such platform may serve as a useful tool which facilitates the burdens connected with measurement and analysis tasks of experimental semiconductor structures. The devised solution provides the functionality of carrier substrate (Al2O3 compound) with CTE compatibility to the experimental silicon chip and is fully customizable with respect to a particular chip. It also allows achieving an easy fan-out of small-diameter chip terminals into a larger, more convenient area and placement of chip specimens conveniently into space-constrained chamber of the AFM microscopes, probe stations, etc. Real application of the developed chip expander platform is demonstrated in context of digital reconfigurable circuits based on polymorphic electronics. In this case the chip expander with attached polymorphic chip REPOMO is thermally stabilized at an ambient temperature level up to approximately 135C and its sensitivity to this phenomenon is demonstrated.

Název v anglickém jazyce

Reconfigurable Digital Circuits Based on Chip Expander with Integrated Temperature Regulation

Popis výsledku anglicky

This article is dealing with a development of custom chip expander platform with the possibility of accurate temperature control and integration of additional silicon-based features. Such platform may serve as a useful tool which facilitates the burdens connected with measurement and analysis tasks of experimental semiconductor structures. The devised solution provides the functionality of carrier substrate (Al2O3 compound) with CTE compatibility to the experimental silicon chip and is fully customizable with respect to a particular chip. It also allows achieving an easy fan-out of small-diameter chip terminals into a larger, more convenient area and placement of chip specimens conveniently into space-constrained chamber of the AFM microscopes, probe stations, etc. Real application of the developed chip expander platform is demonstrated in context of digital reconfigurable circuits based on polymorphic electronics. In this case the chip expander with attached polymorphic chip REPOMO is thermally stabilized at an ambient temperature level up to approximately 135C and its sensitivity to this phenomenon is demonstrated.

Druh

J_ost - Ostatní články v recenzovaných periodicích

CEP obor

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OECD FORD obor

20206 - Computer hardware and architecture

Projekt

Výsledek vznikl pri realizaci vícero projektů. Více informací v záložce Projekty.

Návaznosti

P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)

Rok uplatnění

2015

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název periodika

Journal of Computer and Communications

ISSN

2327-5227

e-ISSN

—

Svazek periodika

3

Číslo periodika v rámci svazku

11

Stát vydavatele periodika

CN - Čínská lidová republika

Počet stran výsledku

7

Strana od-do

169-175

Kód UT WoS článku

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EID výsledku v databázi Scopus

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