PCB Tests During Assembly and Splitting
Identifikátory výsledku
Kód výsledku v IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F47718684%3A_____%2F18%3AN0000034" target="_blank" >RIV/47718684:_____/18:N0000034 - isvavai.cz</a>
Výsledek na webu
<a href="http://www.vzuplzen.cz" target="_blank" >http://www.vzuplzen.cz</a>
DOI - Digital Object Identifier
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Alternativní jazyky
Jazyk výsledku
angličtina
Název v původním jazyce
PCB Tests During Assembly and Splitting
Popis výsledku v původním jazyce
The object of this presentation is the flexure inspection of printed circuit boards during assembly and operation. The goal is to identify high stresses which can lead to destruction especially of the soldered connections during final product operation using strain gauge technique. The strain gauge tests of printed circuit boards (PCB) represents complex work including FEA analysis, strain gauges installation and measurement and sometimes metallographic analysis of the cracked soldered joint, which often is the initiation for the own strain investigation. In. Proceedings of 18th International Conference on Experimental Mechanics ICEM 2018, Brussels (Belgium), USB Flash Disk (4 pages), June 2019. ISSN 2504-3900
Název v anglickém jazyce
PCB Tests During Assembly and Splitting
Popis výsledku anglicky
The object of this presentation is the flexure inspection of printed circuit boards during assembly and operation. The goal is to identify high stresses which can lead to destruction especially of the soldered connections during final product operation using strain gauge technique. The strain gauge tests of printed circuit boards (PCB) represents complex work including FEA analysis, strain gauges installation and measurement and sometimes metallographic analysis of the cracked soldered joint, which often is the initiation for the own strain investigation. In. Proceedings of 18th International Conference on Experimental Mechanics ICEM 2018, Brussels (Belgium), USB Flash Disk (4 pages), June 2019. ISSN 2504-3900
Klasifikace
Druh
O - Ostatní výsledky
CEP obor
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OECD FORD obor
20303 - Thermodynamics
Návaznosti výsledku
Projekt
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Návaznosti
I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace
Ostatní
Rok uplatnění
2018
Kód důvěrnosti údajů
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů