Usage of inert atmosphere for solderability testing

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F12%3A43916859" target="_blank" >RIV/49777513:23220/12:43916859 - isvavai.cz</a>

Výsledek na webu

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DOI - Digital Object Identifier

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Jazyk výsledku

angličtina

Název v původním jazyce

Usage of inert atmosphere for solderability testing

Popis výsledku v původním jazyce

The article will present the results of the measured values from solderability testing of printed circuit boards. The aim of this paper is to compare different atmosphere for solderability testing with different finishes of printed circuit boards (PCB's). The article contains a description of the methods used for solderability testing of printed circuit boards. The method of wetting balance test was chosen for this experiment. The PCB can be made with several kinds of surface finishing. Copper is the most commonly used material in the manufacture of printed circuit boards. The negative property of copper is its low chemical stability. When a contact is in an atmosphere that contains oxygen, the surface is covered with a layer of copper oxides. This layer deteriorates copper solderability. Another way how to prevent oxidation of copper soldering pads of printed circuit boards is an inert atmosphere. As an inert atmosphere not contains oxygen prevents oxidation of the material used on PC

Název v anglickém jazyce

Usage of inert atmosphere for solderability testing

Popis výsledku anglicky

The article will present the results of the measured values from solderability testing of printed circuit boards. The aim of this paper is to compare different atmosphere for solderability testing with different finishes of printed circuit boards (PCB's). The article contains a description of the methods used for solderability testing of printed circuit boards. The method of wetting balance test was chosen for this experiment. The PCB can be made with several kinds of surface finishing. Copper is the most commonly used material in the manufacture of printed circuit boards. The negative property of copper is its low chemical stability. When a contact is in an atmosphere that contains oxygen, the surface is covered with a layer of copper oxides. This layer deteriorates copper solderability. Another way how to prevent oxidation of copper soldering pads of printed circuit boards is an inert atmosphere. As an inert atmosphere not contains oxygen prevents oxidation of the material used on PC

Druh

J_x - Nezařazeno - Článek v odborném periodiku (Jimp, Jsc a Jost)

CEP obor

JA - Elektronika a optoelektronika, elektrotechnika

OECD FORD obor

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Projekt

<a href="/cs/project/ED2.1.00%2F03.0094" target="_blank" >ED2.1.00/03.0094: Regionální inovační centrum elektrotechniky (RICE)</a><br>

Návaznosti

P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2012

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název periodika

Electroscope

ISSN

1802-4564

e-ISSN

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Svazek periodika

2012

Číslo periodika v rámci svazku

6

Stát vydavatele periodika

CZ - Česká republika

Počet stran výsledku

4

Strana od-do

1-4

Kód UT WoS článku

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EID výsledku v databázi Scopus

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