Defect Level Prediction for Newly Designed Printed Circuit Board Assemblies

Kód výsledku v IS VaVaI

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Výsledek na webu

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DOI - Digital Object Identifier

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Jazyk výsledku

angličtina

Název v původním jazyce

Defect Level Prediction for Newly Designed Printed Circuit Board Assemblies

Popis výsledku v původním jazyce

In this paper a new defect level prediction tool is presented, which is intended for newly designed printed circuit board assemblies, especially for the PCBAs (Printed Circuit Board Assembly) determined for automotive industry. The tool is programmed inVisual Basic for Application (VBA) and can be operated in MS Excel environment. On the one hand, the defect level prediction tool results from the parts stress analysis prediction technique, but on the other, it results also from a defect level prediction model of PCBA manufacturing processes, which was created on the basis of empirical data coming from automotive electronics industry. The tool provides a prognosis in defects per million parts produced (dpm), which PCBA will reach in the field (field quality) and at delivery (delivery quality). A significant advantage of this tool lies in its feature, which allows the user to change test parameters and processes in order to fulfil customer requirements. The tool also provides a possibil

Název v anglickém jazyce

Defect Level Prediction for Newly Designed Printed Circuit Board Assemblies

Popis výsledku anglicky

In this paper a new defect level prediction tool is presented, which is intended for newly designed printed circuit board assemblies, especially for the PCBAs (Printed Circuit Board Assembly) determined for automotive industry. The tool is programmed inVisual Basic for Application (VBA) and can be operated in MS Excel environment. On the one hand, the defect level prediction tool results from the parts stress analysis prediction technique, but on the other, it results also from a defect level prediction model of PCBA manufacturing processes, which was created on the basis of empirical data coming from automotive electronics industry. The tool provides a prognosis in defects per million parts produced (dpm), which PCBA will reach in the field (field quality) and at delivery (delivery quality). A significant advantage of this tool lies in its feature, which allows the user to change test parameters and processes in order to fulfil customer requirements. The tool also provides a possibil

Druh

D - Stať ve sborníku

CEP obor

JS - Řízení spolehlivosti a kvality, zkušebnictví

OECD FORD obor

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Projekt

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Návaznosti

S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2009

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

ISSE 2009

ISBN

978-1-4244-4260-7

ISSN

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e-ISSN

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Počet stran výsledku

5

Strana od-do

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Název nakladatele

IEEE

Místo vydání

Piscataway

Místo konání akce

Brno

Datum konání akce

1. 1. 2009

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

000277445500059