The area of spread solderability test use for roughness influence assessment

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F10%3A43924974" target="_blank" >RIV/49777513:23220/10:43924974 - isvavai.cz</a>

Výsledek na webu

<a href="http://dx.doi.org/10.1109/ISSE.2010.5547277" target="_blank" >http://dx.doi.org/10.1109/ISSE.2010.5547277</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1109/ISSE.2010.5547277" target="_blank" >10.1109/ISSE.2010.5547277</a>

Jazyk výsledku

angličtina

Název v původním jazyce

The area of spread solderability test use for roughness influence assessment

Popis výsledku v původním jazyce

The article deals with the influence of surface roughness on solderability. The area of spread test was used as a method for solderability measurement. For this measurement, test samples made from substrates for printed circuit boards, small solder balls, and two soldering technologies ? vapor-phase and reflow soldering - were used. These technologies have been used because of similarity with the industrial process of soldering. The subjects of examination and comparison were wetting angle and expanse of melted solder on the surface. The paper presents results and conclusions from solderability testing of printed circuit boards with various surface roughnesses. Other conclusion is comparison of several types of fluxes and their impact on solder wettingon roughened surface.

Název v anglickém jazyce

The area of spread solderability test use for roughness influence assessment

Popis výsledku anglicky

The article deals with the influence of surface roughness on solderability. The area of spread test was used as a method for solderability measurement. For this measurement, test samples made from substrates for printed circuit boards, small solder balls, and two soldering technologies ? vapor-phase and reflow soldering - were used. These technologies have been used because of similarity with the industrial process of soldering. The subjects of examination and comparison were wetting angle and expanse of melted solder on the surface. The paper presents results and conclusions from solderability testing of printed circuit boards with various surface roughnesses. Other conclusion is comparison of several types of fluxes and their impact on solder wettingon roughened surface.

Druh

D - Stať ve sborníku

CEP obor

JA - Elektronika a optoelektronika, elektrotechnika

OECD FORD obor

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Projekt

—

Návaznosti

Z - Vyzkumny zamer (s odkazem do CEZ)

Rok uplatnění

2010

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

ISSE 2010

ISBN

978-1-4244-7850-7

ISSN

—

e-ISSN

—

Počet stran výsledku

6

Strana od-do

1-6

Název nakladatele

Warsaw University of Technology

Místo vydání

Warsaw

Místo konání akce

Warsaw

Datum konání akce

12. 5. 2010

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

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