Comparison of solderability testing methods of PCBS with different surface finishes

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F11%3A43899151" target="_blank" >RIV/49777513:23220/11:43899151 - isvavai.cz</a>

Výsledek na webu

—

DOI - Digital Object Identifier

—

Jazyk výsledku

angličtina

Název v původním jazyce

Comparison of solderability testing methods of PCBS with different surface finishes

Popis výsledku v původním jazyce

This paper presents the results of solderability testing of printed circuit boards. The aim of this paper is to compare different methods of solderability testing with different finishes of PCB?s. Recommendation of solderability test methods suitable forthe technological processes of soldering is mentioned at the end. The article contains a detailed description of the methods used for solderability testing of printed circuit boards. The most commonly used methods include the method of wetting balance test, area of spread test, dip and look test, meniscus rise method, and rotary dip method. Solderability testing can determine how much is the material suitable for industrial soldering. The mass production of electronic devices uses several soldering technologies. These technologies can be divided into two basic groups. The first group is wave soldering and the second group is reflow soldering. Reflow soldering can be further divided according to the source of heat required to reflow the

Název v anglickém jazyce

Comparison of solderability testing methods of PCBS with different surface finishes

Popis výsledku anglicky

This paper presents the results of solderability testing of printed circuit boards. The aim of this paper is to compare different methods of solderability testing with different finishes of PCB?s. Recommendation of solderability test methods suitable forthe technological processes of soldering is mentioned at the end. The article contains a detailed description of the methods used for solderability testing of printed circuit boards. The most commonly used methods include the method of wetting balance test, area of spread test, dip and look test, meniscus rise method, and rotary dip method. Solderability testing can determine how much is the material suitable for industrial soldering. The mass production of electronic devices uses several soldering technologies. These technologies can be divided into two basic groups. The first group is wave soldering and the second group is reflow soldering. Reflow soldering can be further divided according to the source of heat required to reflow the

Druh

D - Stať ve sborníku

CEP obor

JA - Elektronika a optoelektronika, elektrotechnika

OECD FORD obor

—

Projekt

—

Návaznosti

Z - Vyzkumny zamer (s odkazem do CEZ)<br>S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2011

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

Electronic devices and systems : IMAPS CS international conference : proceedings

ISBN

978-80-214-4303-7

ISSN

—

e-ISSN

—

Počet stran výsledku

6

Strana od-do

229-234

Název nakladatele

Vysoké učení technické

Místo vydání

Brno

Místo konání akce

Brno

Datum konání akce

22. 6. 2011

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

—