Comparison of Rosin Fluxes

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F13%3A43919722" target="_blank" >RIV/49777513:23220/13:43919722 - isvavai.cz</a>

Výsledek na webu

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DOI - Digital Object Identifier

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Jazyk výsledku

angličtina

Název v původním jazyce

Comparison of Rosin Fluxes

Popis výsledku v původním jazyce

This article will present results of activity testing of rosin fluxes. A good solderability of a component output and a soldering pad of PCB are important for the creation of a quality joint. Since it supports a melted solder wetting on a soldered surface, a flux has a definitive influence on the creation of a quality joint. Further, it removes oxides and other impurities from soldering alloys and prevents from a creation of a new oxide layer during soldering. According the technology of a solder jointcreation, a flux is added into the soldering process in different ways. The aim of the test was to select a rosin flux having with the solder tube the best results during soldering of the copper surface on PCB's. Fluxes were compared by the help of two different tests. The first trial was carried out by the area of spread method, since this test is suitable for solderability testing of materials and comparison of a flux activity. The wetting balance test was chosen as the second trial. T

Název v anglickém jazyce

Comparison of Rosin Fluxes

Popis výsledku anglicky

This article will present results of activity testing of rosin fluxes. A good solderability of a component output and a soldering pad of PCB are important for the creation of a quality joint. Since it supports a melted solder wetting on a soldered surface, a flux has a definitive influence on the creation of a quality joint. Further, it removes oxides and other impurities from soldering alloys and prevents from a creation of a new oxide layer during soldering. According the technology of a solder jointcreation, a flux is added into the soldering process in different ways. The aim of the test was to select a rosin flux having with the solder tube the best results during soldering of the copper surface on PCB's. Fluxes were compared by the help of two different tests. The first trial was carried out by the area of spread method, since this test is suitable for solderability testing of materials and comparison of a flux activity. The wetting balance test was chosen as the second trial. T

Druh

J_x - Nezařazeno - Článek v odborném periodiku (Jimp, Jsc a Jost)

CEP obor

JA - Elektronika a optoelektronika, elektrotechnika

OECD FORD obor

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Projekt

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Návaznosti

S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2013

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název periodika

Electroscope

ISSN

1802-4564

e-ISSN

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Svazek periodika

2013

Číslo periodika v rámci svazku

5

Stát vydavatele periodika

CZ - Česká republika

Počet stran výsledku

4

Strana od-do

1-4

Kód UT WoS článku

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EID výsledku v databázi Scopus

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