Kontaminace DPS po pájecím procesu s "NO-Clean" pájecími pastami

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F13%3A43919730" target="_blank" >RIV/49777513:23220/13:43919730 - isvavai.cz</a>

Výsledek na webu

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DOI - Digital Object Identifier

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Jazyk výsledku

čeština

Název v původním jazyce

Kontaminace DPS po pájecím procesu s "NO-Clean" pájecími pastami

Popis výsledku v původním jazyce

This paper deals with contamination of PCB after soldering process. First part presents the ionic contamination and the experiment. For measuring of contamination the contaminometer CM11 was chosen. Three No-clean solder pastes were used for testing. Thetested samples were made of PCB where the solder pastes were applied. The tested samples were soldered with different solder profiles. After the soldering process ionic contamination was measured and evaluated. The obtained results were discussed.

Název v anglickém jazyce

Contamination of PCB after the soldering process with ?NO-clean? solder pastes

Popis výsledku anglicky

This paper deals with contamination of PCB after soldering process. First part presents the ionic contamination and the experiment. For measuring of contamination the contaminometer CM11 was chosen. Three No-clean solder pastes were used for testing. Thetested samples were made of PCB where the solder pastes were applied. The tested samples were soldered with different solder profiles. After the soldering process ionic contamination was measured and evaluated. The obtained results were discussed.

Druh

O - Ostatní výsledky

CEP obor

JA - Elektronika a optoelektronika, elektrotechnika

OECD FORD obor

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Projekt

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Návaznosti

S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2013

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů