Optimization of soldering process to reduce contamination and related consequences

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F18%3A43951566" target="_blank" >RIV/49777513:23220/18:43951566 - isvavai.cz</a>

Výsledek na webu

<a href="https://ieeexplore.ieee.org/document/8443691" target="_blank" >https://ieeexplore.ieee.org/document/8443691</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1109/ISSE.2018.8443691" target="_blank" >10.1109/ISSE.2018.8443691</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Optimization of soldering process to reduce contamination and related consequences

Popis výsledku v původním jazyce

This paper deals with soldering profile optimization and with its impacts on the quality of the soldered joint. Properly adjusted soldering profile directly affects the PCB contamination level by flux residues. The experimental part of this article is focused on reducing the amount of ionic contamination on the PCB by means of a suitable setting of the soldering process. The profiles have been set according to the manufacturer&apos;s recommendations. The optimization of the soldering profile has been assessed with regard to the ionic contamination of PCB. Optimized soldering profile, however, affects other solder joints parameters that have an immediate effect on reliability. The consequences of profile optimization is verified by the wetting angle measurement, the intermetallic compound thickness measurement and the amount of voids contained in the solder joint. The paper includes a discussion of the measured results and an overall impact assessment of the profile optimization.

Název v anglickém jazyce

Optimization of soldering process to reduce contamination and related consequences

Popis výsledku anglicky

This paper deals with soldering profile optimization and with its impacts on the quality of the soldered joint. Properly adjusted soldering profile directly affects the PCB contamination level by flux residues. The experimental part of this article is focused on reducing the amount of ionic contamination on the PCB by means of a suitable setting of the soldering process. The profiles have been set according to the manufacturer&apos;s recommendations. The optimization of the soldering profile has been assessed with regard to the ionic contamination of PCB. Optimized soldering profile, however, affects other solder joints parameters that have an immediate effect on reliability. The consequences of profile optimization is verified by the wetting angle measurement, the intermetallic compound thickness measurement and the amount of voids contained in the solder joint. The paper includes a discussion of the measured results and an overall impact assessment of the profile optimization.

Druh

D - Stať ve sborníku

CEP obor

—

OECD FORD obor

20201 - Electrical and electronic engineering

Projekt

<a href="/cs/project/LO1607" target="_blank" >LO1607: RICE – Nové technologie a koncepce pro inteligentní průmyslové systémy</a><br>

Návaznosti

P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2018

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

2018 41st International Spring Seminar on Electronics Technology (ISSE 2018) : /proceedings/

ISBN

978-1-5386-5731-7

ISSN

2161-2528

e-ISSN

2161-2536

Počet stran výsledku

6

Strana od-do

1-6

Název nakladatele

IEEE

Místo vydání

Piscataway

Místo konání akce

Zlatibor, Serbia

Datum konání akce

16. 5. 2018

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

000449866600065