Correlation analysis of wettability, intermetallic compound formation and PCB contamination

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F15%3A43925365" target="_blank" >RIV/49777513:23220/15:43925365 - isvavai.cz</a>

Výsledek na webu

<a href="http://dx.doi.org/10.1108/CW-10-2014-0047" target="_blank" >http://dx.doi.org/10.1108/CW-10-2014-0047</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1108/CW-10-2014-0047" target="_blank" >10.1108/CW-10-2014-0047</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Correlation analysis of wettability, intermetallic compound formation and PCB contamination

Popis výsledku v původním jazyce

The purpose of this paper is to verify how solder joint properties correlate with soldering profile set-up. These characteristics act against each other. All observed properties may significantly affect the quality and reliability of solder joints. The purpose is also to design recommendations for manufacturers of electronic assemblies.The samples for experiment were reflowed by using a laboratory reflow oven. A LEXT laser confocal microscope was used for wetting angle and intermetallic compound (IMC) thickness measurement. The ionic contamination was measured by using a contaminometer.The appropriate choice of soldering profile is very important for the reliability of electronic assemblies. The higher temperatures or longer preheating and soldering times improve the wetting angle. Likewise, there is also the activation of all the fluxes. The result is low contamination with printed circuit boards (PCBs). On the other hand, we must not forget that higher temperatures and longer solderi

Název v anglickém jazyce

Correlation analysis of wettability, intermetallic compound formation and PCB contamination

Popis výsledku anglicky

The purpose of this paper is to verify how solder joint properties correlate with soldering profile set-up. These characteristics act against each other. All observed properties may significantly affect the quality and reliability of solder joints. The purpose is also to design recommendations for manufacturers of electronic assemblies.The samples for experiment were reflowed by using a laboratory reflow oven. A LEXT laser confocal microscope was used for wetting angle and intermetallic compound (IMC) thickness measurement. The ionic contamination was measured by using a contaminometer.The appropriate choice of soldering profile is very important for the reliability of electronic assemblies. The higher temperatures or longer preheating and soldering times improve the wetting angle. Likewise, there is also the activation of all the fluxes. The result is low contamination with printed circuit boards (PCBs). On the other hand, we must not forget that higher temperatures and longer solderi

Druh

J_x - Nezařazeno - Článek v odborném periodiku (Jimp, Jsc a Jost)

CEP obor

JA - Elektronika a optoelektronika, elektrotechnika

OECD FORD obor

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Projekt

<a href="/cs/project/ED2.1.00%2F03.0094" target="_blank" >ED2.1.00/03.0094: Regionální inovační centrum elektrotechniky (RICE)</a><br>

Návaznosti

P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)

Rok uplatnění

2015

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název periodika

Circuit world

ISSN

0305-6120

e-ISSN

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Svazek periodika

41

Číslo periodika v rámci svazku

2

Stát vydavatele periodika

GB - Spojené království Velké Británie a Severního Irska

Počet stran výsledku

6

Strana od-do

70-75

Kód UT WoS článku

000353302000004

EID výsledku v databázi Scopus

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