Impact of no-clean fluxes cleaning on PCB Ionic contamination
Identifikátory výsledku
Kód výsledku v IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F15%3A43925341" target="_blank" >RIV/49777513:23220/15:43925341 - isvavai.cz</a>
Výsledek na webu
<a href="http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7247989&newsearch=true&queryText=Impact%20of%20no-clean%20fluxes%20cleaning%20on%20PCB%20Ionic%20contamination" target="_blank" >http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7247989&newsearch=true&queryText=Impact%20of%20no-clean%20fluxes%20cleaning%20on%20PCB%20Ionic%20contamination</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE.2015.7247989" target="_blank" >10.1109/ISSE.2015.7247989</a>
Alternativní jazyky
Jazyk výsledku
angličtina
Název v původním jazyce
Impact of no-clean fluxes cleaning on PCB Ionic contamination
Popis výsledku v původním jazyce
The paper describes the dependence of the ionic contamination of PCB after the soldering process with no-clean solder pastes on the type of cleaning. For the experiment three different types of solder paste were selected. Solder pastes were labeled as no-clean. The samples were reflowed with two different soldered profiles. The ionic contamination after soldering process was measured. Contamination of PCB was investigated to set up of solder profile. Then three different types of rinses were applied tothe samples. The rinsing medium was deionized water, 50% deionized water with 50% isopropyl alcohol (IPA) and IPA. The cleaning process was set to 10 minutes in an ultrasonic cleaning bath. Then rate of ionic contamination after application of cleaning the PCB were monitored. From the results there were determined by a recommendation on whether it is necessary to clean no-clean solder paste.
Název v anglickém jazyce
Impact of no-clean fluxes cleaning on PCB Ionic contamination
Popis výsledku anglicky
The paper describes the dependence of the ionic contamination of PCB after the soldering process with no-clean solder pastes on the type of cleaning. For the experiment three different types of solder paste were selected. Solder pastes were labeled as no-clean. The samples were reflowed with two different soldered profiles. The ionic contamination after soldering process was measured. Contamination of PCB was investigated to set up of solder profile. Then three different types of rinses were applied tothe samples. The rinsing medium was deionized water, 50% deionized water with 50% isopropyl alcohol (IPA) and IPA. The cleaning process was set to 10 minutes in an ultrasonic cleaning bath. Then rate of ionic contamination after application of cleaning the PCB were monitored. From the results there were determined by a recommendation on whether it is necessary to clean no-clean solder paste.
Klasifikace
Druh
D - Stať ve sborníku
CEP obor
JA - Elektronika a optoelektronika, elektrotechnika
OECD FORD obor
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Návaznosti výsledku
Projekt
<a href="/cs/project/ED2.1.00%2F03.0094" target="_blank" >ED2.1.00/03.0094: Regionální inovační centrum elektrotechniky (RICE)</a><br>
Návaznosti
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>S - Specificky vyzkum na vysokych skolach
Ostatní
Rok uplatnění
2015
Kód důvěrnosti údajů
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Údaje specifické pro druh výsledku
Název statě ve sborníku
Proceedings of the 2015 38th International Spring Seminar on Electronics Technology (ISSE 2015)
ISBN
978-1-4799-8860-0
ISSN
2161-2528
e-ISSN
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Počet stran výsledku
5
Strana od-do
1-5
Název nakladatele
IEEE
Místo vydání
Piscataway
Místo konání akce
Eger, Maďarsko
Datum konání akce
6. 5. 2015
Typ akce podle státní příslušnosti
WRD - Celosvětová akce
Kód UT WoS článku
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