SMD components assembly on a flexible substrate by non-conductive adhesives

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F18%3A43951558" target="_blank" >RIV/49777513:23220/18:43951558 - isvavai.cz</a>

Výsledek na webu

<a href="https://ieeexplore.ieee.org/document/8443655" target="_blank" >https://ieeexplore.ieee.org/document/8443655</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1109/ISSE.2018.8443655" target="_blank" >10.1109/ISSE.2018.8443655</a>

Jazyk výsledku

angličtina

Název v původním jazyce

SMD components assembly on a flexible substrate by non-conductive adhesives

Popis výsledku v původním jazyce

This paper presents SMD components assembly by non-conductive adhesives. Two types of non-conductive adhesives were used for the experiment – UV curable acrylic adhesive Loctite AA3926 and two-part epoxy adhesive Loctite HY4092 GY. The purpose of the experiment was to achieve good mechanical and electrical properties of the joint between the SMD component and copper pads made on flexible DuPont Kapton foil. The electrical conductivity was achieved only by mechanical contact of the component and substrate pads. Therefore, the mechanical pressure on the component during curing was important just as the adhesive’s shrinkage rates. Also, the adhesive’s amount causes a noticeable joint property modification. The assembly of the SMD components by non-conductive adhesives was comparable with quite commonly used conductive adhesives within the electrical and shear strength mechanical properties.

Název v anglickém jazyce

SMD components assembly on a flexible substrate by non-conductive adhesives

Popis výsledku anglicky

This paper presents SMD components assembly by non-conductive adhesives. Two types of non-conductive adhesives were used for the experiment – UV curable acrylic adhesive Loctite AA3926 and two-part epoxy adhesive Loctite HY4092 GY. The purpose of the experiment was to achieve good mechanical and electrical properties of the joint between the SMD component and copper pads made on flexible DuPont Kapton foil. The electrical conductivity was achieved only by mechanical contact of the component and substrate pads. Therefore, the mechanical pressure on the component during curing was important just as the adhesive’s shrinkage rates. Also, the adhesive’s amount causes a noticeable joint property modification. The assembly of the SMD components by non-conductive adhesives was comparable with quite commonly used conductive adhesives within the electrical and shear strength mechanical properties.

Druh

D - Stať ve sborníku

CEP obor

—

OECD FORD obor

20201 - Electrical and electronic engineering

Projekt

<a href="/cs/project/LO1607" target="_blank" >LO1607: RICE – Nové technologie a koncepce pro inteligentní průmyslové systémy</a><br>

Návaznosti

P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2018

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

2018 41st International Spring Seminar on Electronics Technology (ISSE 2018) : /proceedings/

ISBN

978-1-5386-5731-7

ISSN

2161-2528

e-ISSN

2161-2536

Počet stran výsledku

6

Strana od-do

1-6

Název nakladatele

IEEE

Místo vydání

Piscataway

Místo konání akce

Zlatibor, Serbia

Datum konání akce

16. 5. 2018

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

000449866600029