Alternative technology for SMD components connection by non‑conductive adhesive on a flexible substrate

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F19%3A43955589" target="_blank" >RIV/49777513:23220/19:43955589 - isvavai.cz</a>

Výsledek na webu

<a href="https://link.springer.com/article/10.1007/s10854-019-01789-w" target="_blank" >https://link.springer.com/article/10.1007/s10854-019-01789-w</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1007/s10854-019-01789-w" target="_blank" >10.1007/s10854-019-01789-w</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Alternative technology for SMD components connection by non‑conductive adhesive on a flexible substrate

Popis výsledku v původním jazyce

This article deals with the assembly of SMD chip components onto a flexible substrate by using non-conductive adhesives. In the experiments, two electrically conductive adhesives (ECA) and two non-conductive adhesives (NCA) were used. The verification of the properties and usability of NCAs for connecting the components to the flexible substrates as an alternative for ECA was the main goal of the experiment. The results show that NCAs can be used as an alternative for ECAs and that the properties and reliability of NCA joints are comparable or better than ECA joints. The results also show that UV-curable NCAs can be recommended for the applications of attaching the components on flexible substrates, especially for the prototypes, where the application of the UV adhesive and the connection of components by this technology is much easier and faster than with ECA.

Název v anglickém jazyce

Alternative technology for SMD components connection by non‑conductive adhesive on a flexible substrate

Popis výsledku anglicky

This article deals with the assembly of SMD chip components onto a flexible substrate by using non-conductive adhesives. In the experiments, two electrically conductive adhesives (ECA) and two non-conductive adhesives (NCA) were used. The verification of the properties and usability of NCAs for connecting the components to the flexible substrates as an alternative for ECA was the main goal of the experiment. The results show that NCAs can be used as an alternative for ECAs and that the properties and reliability of NCA joints are comparable or better than ECA joints. The results also show that UV-curable NCAs can be recommended for the applications of attaching the components on flexible substrates, especially for the prototypes, where the application of the UV adhesive and the connection of components by this technology is much easier and faster than with ECA.

Druh

J_imp - Článek v periodiku v databázi Web of Science

CEP obor

—

OECD FORD obor

20201 - Electrical and electronic engineering

Projekt

<a href="/cs/project/EF18_069%2F0009855" target="_blank" >EF18_069/0009855: Elektrotechnické technologie s vysokým podílem vestavěné inteligence</a><br>

Návaznosti

P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>S - Specificky vyzkum na vysokych skolach<br>I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Rok uplatnění

2019

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název periodika

Journal of Materials Science: Materials in Electronics

ISSN

0957-4522

e-ISSN

—

Svazek periodika

30

Číslo periodika v rámci svazku

15

Stát vydavatele periodika

NL - Nizozemsko

Počet stran výsledku

10

Strana od-do

14214-14223

Kód UT WoS článku

000478863500040

EID výsledku v databázi Scopus

2-s2.0-85068867587