Comparison of QFN chips glued by ACA and NCA adhesives on the flexible substrate

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F19%3A43955861" target="_blank" >RIV/49777513:23220/19:43955861 - isvavai.cz</a>

Výsledek na webu

<a href="https://ieeexplore.ieee.org/document/8951828" target="_blank" >https://ieeexplore.ieee.org/document/8951828</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.23919/EMPC44848.2019.8951828" target="_blank" >10.23919/EMPC44848.2019.8951828</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Comparison of QFN chips glued by ACA and NCA adhesives on the flexible substrate

Popis výsledku v původním jazyce

The paper deals with the QFN components assembly to the PET substrate with silver conductive pattern by anisotropically conductive adhesive (ACA) or non-conductive adhesive (NCA) with UV curing. Motivation for the experiment was to investigate and compare conductive joints prepared by ACA and NCA and make comparison of their reliability during the accelerated climatic ageing. For the NCA adhesive, the electrical conductivity was achieved by mechanical contact of the QFN component pads and substrate pattern pads. Therefore, the downforce on the QFN chip during the UV curing was important just as the adhesive´s shrinkage rate. The assembly of the QFN components by non-conductive adhesive had similar or better properties in comparison with anisotropically conductive adhesive (ACA) joints and therefore non-conductive adhesives could be recommended for some special applications.

Název v anglickém jazyce

Comparison of QFN chips glued by ACA and NCA adhesives on the flexible substrate

Popis výsledku anglicky

The paper deals with the QFN components assembly to the PET substrate with silver conductive pattern by anisotropically conductive adhesive (ACA) or non-conductive adhesive (NCA) with UV curing. Motivation for the experiment was to investigate and compare conductive joints prepared by ACA and NCA and make comparison of their reliability during the accelerated climatic ageing. For the NCA adhesive, the electrical conductivity was achieved by mechanical contact of the QFN component pads and substrate pattern pads. Therefore, the downforce on the QFN chip during the UV curing was important just as the adhesive´s shrinkage rate. The assembly of the QFN components by non-conductive adhesive had similar or better properties in comparison with anisotropically conductive adhesive (ACA) joints and therefore non-conductive adhesives could be recommended for some special applications.

Druh

D - Stať ve sborníku

CEP obor

—

OECD FORD obor

20201 - Electrical and electronic engineering

Projekt

<a href="/cs/project/LO1607" target="_blank" >LO1607: RICE – Nové technologie a koncepce pro inteligentní průmyslové systémy</a><br>

Návaznosti

P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2019

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

Proceedings of the 22nd Microelectronics and Packaging Conference (EMPC 2019)

ISBN

978-0-9568086-6-0

ISSN

—

e-ISSN

—

Počet stran výsledku

7

Strana od-do

1-7

Název nakladatele

IEEE

Místo vydání

Piscataway

Místo konání akce

Pisa, Italy

Datum konání akce

16. 9. 2019

Typ akce podle státní příslušnosti

EUR - Evropská akce

Kód UT WoS článku

000532694100053