Glass transition temperature of nanoparticle-enhanced and environmentally stressed conductive adhesive materials for electronics assembly

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F19%3A43955221" target="_blank" >RIV/49777513:23220/19:43955221 - isvavai.cz</a>

Nalezeny alternativní kódy

RIV/68407700:21230/19:00331512

Výsledek na webu

<a href="https://link.springer.com/article/10.1007/s10854-019-00784-5" target="_blank" >https://link.springer.com/article/10.1007/s10854-019-00784-5</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1007/s10854-019-00784-5" target="_blank" >10.1007/s10854-019-00784-5</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Glass transition temperature of nanoparticle-enhanced and environmentally stressed conductive adhesive materials for electronics assembly

Popis výsledku v původním jazyce

In our paper, the characterization of glass transition temperature (Tg) was performed for one- and two-component electrically conductive adhesive used in electronic joining technologies. Both adhesives were of the epoxy type with the silver filler. Dynamic mechanical analysis (DMA) was used to measure the Tg. The adhesives were modified with nanoparticles, namely, carbon nanotubes (concentration of 0.5 and 0.8% by weight) and silver nanoballs (2.5% by weight). The values of Tg were determined from the plot of the Tg δ parameter. Two types of environmental stresses were used for climatic aging: 125 °C/56% RH and 85 °C/85% RH. The aging of the samples at 125 °C and 56% RH caused increase Tg for all formulations. The cause of these changes is additional curing of adhesive. Aging in the combined climate 85 °C/85% RH caused a shift in Tg toward lower values for formulations based on the one-component adhesive modified by CNT and toward higher values for all other formulations. The major cause of the decrease in Tg was that CNT inhered the curing reactions and banned them from completion. In cases where Tg grew, glue hardening take place. DMA was performed to examine Tg of the samples. The DMA measurements were carried out up to 200 °C. Repeated DMA measurement confirmed that this measurement caused additional hardening and increase Tg for all samples. The results will contribute to the use of conductive adhesives with better quality and reliability in electronics manufacturing.

Název v anglickém jazyce

Glass transition temperature of nanoparticle-enhanced and environmentally stressed conductive adhesive materials for electronics assembly

Popis výsledku anglicky

In our paper, the characterization of glass transition temperature (Tg) was performed for one- and two-component electrically conductive adhesive used in electronic joining technologies. Both adhesives were of the epoxy type with the silver filler. Dynamic mechanical analysis (DMA) was used to measure the Tg. The adhesives were modified with nanoparticles, namely, carbon nanotubes (concentration of 0.5 and 0.8% by weight) and silver nanoballs (2.5% by weight). The values of Tg were determined from the plot of the Tg δ parameter. Two types of environmental stresses were used for climatic aging: 125 °C/56% RH and 85 °C/85% RH. The aging of the samples at 125 °C and 56% RH caused increase Tg for all formulations. The cause of these changes is additional curing of adhesive. Aging in the combined climate 85 °C/85% RH caused a shift in Tg toward lower values for formulations based on the one-component adhesive modified by CNT and toward higher values for all other formulations. The major cause of the decrease in Tg was that CNT inhered the curing reactions and banned them from completion. In cases where Tg grew, glue hardening take place. DMA was performed to examine Tg of the samples. The DMA measurements were carried out up to 200 °C. Repeated DMA measurement confirmed that this measurement caused additional hardening and increase Tg for all samples. The results will contribute to the use of conductive adhesives with better quality and reliability in electronics manufacturing.

Druh

J_imp - Článek v periodiku v databázi Web of Science

CEP obor

—

OECD FORD obor

20505 - Composites (including laminates, reinforced plastics, cermets, combined natural and synthetic fibre fabrics; filled composites)

Projekt

—

Návaznosti

I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Rok uplatnění

2019

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název periodika

Journal of Materials Science: Materials in Electronics

ISSN

0957-4522

e-ISSN

—

Svazek periodika

30

Číslo periodika v rámci svazku

5

Stát vydavatele periodika

NL - Nizozemsko

Počet stran výsledku

13

Strana od-do

4895-4907

Kód UT WoS článku

000461168600058

EID výsledku v databázi Scopus

2-s2.0-85061500749