Sintering of printed Ag on ceramic substrates with the use of formic acid

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F21%3A43962018" target="_blank" >RIV/49777513:23220/21:43962018 - isvavai.cz</a>

Výsledek na webu

<a href="https://ieeexplore.ieee.org/document/9467610" target="_blank" >https://ieeexplore.ieee.org/document/9467610</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1109/ISSE51996.2021.9467610" target="_blank" >10.1109/ISSE51996.2021.9467610</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Sintering of printed Ag on ceramic substrates with the use of formic acid

Popis výsledku v původním jazyce

This paper deals with joints creation on ceramic substrates with printed conductive patterns made from copper and silver. Sintering on the printed patterns is extremely specific because of porous structure, big grains, and glassy phase. Joints are created using pressureless sintering technology with silver-based nanoparticle paste and its sintering occurred in various atmosphere settings, using the air, formic acid or with the combination of both. Sintering is the most promising die-attach technique for power electronic devices. Presented paper deals with the process of sintering on the printed patterns, including deposition of the sintering paste, selecting, and defining correct temperature profiles. Different pre-process cleaning procedures were also applied. For evaluation, shear test showing mechanical strength and also x-ray images for advanced analysis of internal structure were used.

Název v anglickém jazyce

Sintering of printed Ag on ceramic substrates with the use of formic acid

Popis výsledku anglicky

This paper deals with joints creation on ceramic substrates with printed conductive patterns made from copper and silver. Sintering on the printed patterns is extremely specific because of porous structure, big grains, and glassy phase. Joints are created using pressureless sintering technology with silver-based nanoparticle paste and its sintering occurred in various atmosphere settings, using the air, formic acid or with the combination of both. Sintering is the most promising die-attach technique for power electronic devices. Presented paper deals with the process of sintering on the printed patterns, including deposition of the sintering paste, selecting, and defining correct temperature profiles. Different pre-process cleaning procedures were also applied. For evaluation, shear test showing mechanical strength and also x-ray images for advanced analysis of internal structure were used.

Druh

D - Stať ve sborníku

CEP obor

—

OECD FORD obor

20201 - Electrical and electronic engineering

Projekt

<a href="/cs/project/EF18_069%2F0009855" target="_blank" >EF18_069/0009855: Elektrotechnické technologie s vysokým podílem vestavěné inteligence</a><br>

Návaznosti

P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>S - Specificky vyzkum na vysokych skolach<br>I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Rok uplatnění

2021

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

2021 44th International Spring Seminar on Electronics Technology : /proceedings/

ISBN

978-1-66541-477-7

ISSN

—

e-ISSN

2161-2536

Počet stran výsledku

5

Strana od-do

1-5

Název nakladatele

IEEE

Místo vydání

Piscaway

Místo konání akce

web-basec Conference, Bautzen, Germany

Datum konání akce

5. 5. 2021

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

000853459100050