Influence of sweat on joints reliability between SMD chip resistors and conductive ribbons
Identifikátory výsledku
Kód výsledku v IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F21%3A43962562" target="_blank" >RIV/49777513:23220/21:43962562 - isvavai.cz</a>
Výsledek na webu
<a href="https://pcns.events/wp-content/uploads/2021/09/3rdPCNSProceedings-eBook-compressed.pdf" target="_blank" >https://pcns.events/wp-content/uploads/2021/09/3rdPCNSProceedings-eBook-compressed.pdf</a>
DOI - Digital Object Identifier
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Alternativní jazyky
Jazyk výsledku
angličtina
Název v původním jazyce
Influence of sweat on joints reliability between SMD chip resistors and conductive ribbons
Popis výsledku v původním jazyce
The article deals with the reliability testing of SMD chip resistors glued / soldered on conductive textile ribbons during ageing by artificial sweat. For the experiment, the flexible and stretchable textile ribbons with conductive track woven inside were used. The passive SMD chip resistors were conductively (low temperature soldering / UV gluing) connected onto the conductive tracks in ribbons. The prepared samples were submitted to the accelerated ageing by two types of artificial sweat (alkaline, acidic). The results show that reliability of soldered joints after ageing is better but both methods are usable for dedicated applications.
Název v anglickém jazyce
Influence of sweat on joints reliability between SMD chip resistors and conductive ribbons
Popis výsledku anglicky
The article deals with the reliability testing of SMD chip resistors glued / soldered on conductive textile ribbons during ageing by artificial sweat. For the experiment, the flexible and stretchable textile ribbons with conductive track woven inside were used. The passive SMD chip resistors were conductively (low temperature soldering / UV gluing) connected onto the conductive tracks in ribbons. The prepared samples were submitted to the accelerated ageing by two types of artificial sweat (alkaline, acidic). The results show that reliability of soldered joints after ageing is better but both methods are usable for dedicated applications.
Klasifikace
Druh
O - Ostatní výsledky
CEP obor
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OECD FORD obor
20201 - Electrical and electronic engineering
Návaznosti výsledku
Projekt
<a href="/cs/project/EF18_069%2F0009855" target="_blank" >EF18_069/0009855: Elektrotechnické technologie s vysokým podílem vestavěné inteligence</a><br>
Návaznosti
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>S - Specificky vyzkum na vysokych skolach<br>I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace
Ostatní
Rok uplatnění
2021
Kód důvěrnosti údajů
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů