Analysis of the Effect of Soldered Surface Roughness on Void Formation Using Computed Tomography

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F23%3A43968772" target="_blank" >RIV/49777513:23220/23:43968772 - isvavai.cz</a>

Výsledek na webu

<a href="https://ieeexplore.ieee.org/document/10168450" target="_blank" >https://ieeexplore.ieee.org/document/10168450</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1109/ISSE57496.2023.10168450" target="_blank" >10.1109/ISSE57496.2023.10168450</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Analysis of the Effect of Soldered Surface Roughness on Void Formation Using Computed Tomography

Popis výsledku v původním jazyce

This article presents research focused on the reliability of soldered joints. The quality of solder joints is related to the presence of voids in solder joints. Voids affect not only joint strength but also other important joint parameters. The paper presents the results of the Computed Tomography (CT) analysis of solder joints. Samples with different base materials and with different roughness of soldered surfaces were analyzed. The distribution of individual void and the total volume of voids in one joint are the results of the analysis. Histograms of void count and void size are presented too. The article also presents sphericity analysis results where it is possible to see how surface roughness affects the shape and size of the voids.

Název v anglickém jazyce

Analysis of the Effect of Soldered Surface Roughness on Void Formation Using Computed Tomography

Popis výsledku anglicky

This article presents research focused on the reliability of soldered joints. The quality of solder joints is related to the presence of voids in solder joints. Voids affect not only joint strength but also other important joint parameters. The paper presents the results of the Computed Tomography (CT) analysis of solder joints. Samples with different base materials and with different roughness of soldered surfaces were analyzed. The distribution of individual void and the total volume of voids in one joint are the results of the analysis. Histograms of void count and void size are presented too. The article also presents sphericity analysis results where it is possible to see how surface roughness affects the shape and size of the voids.

Druh

D - Stať ve sborníku

CEP obor

—

OECD FORD obor

20201 - Electrical and electronic engineering

Projekt

<a href="/cs/project/TN02000067" target="_blank" >TN02000067: Nové směry v elektronice pro průmysl 4.0 a medicínu 4.0</a><br>

Návaznosti

P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)

Rok uplatnění

2023

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

Proceedings of the International Spring Seminar on Electronics Technology

ISBN

979-8-3503-3484-5

ISSN

—

e-ISSN

2161-2536

Počet stran výsledku

5

Strana od-do

—

Název nakladatele

IEEE

Místo vydání

Piscaway

Místo konání akce

Timisoara, Romania

Datum konání akce

10. 5. 2023

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

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