Towards Additively Manufactured Alumina Substrates for Printed Electronics Applications
Identifikátory výsledku
Kód výsledku v IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F24%3A43972538" target="_blank" >RIV/49777513:23220/24:43972538 - isvavai.cz</a>
Výsledek na webu
<a href="https://ieeexplore.ieee.org/document/10604073" target="_blank" >https://ieeexplore.ieee.org/document/10604073</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE61612.2024.10604073" target="_blank" >10.1109/ISSE61612.2024.10604073</a>
Alternativní jazyky
Jazyk výsledku
angličtina
Název v původním jazyce
Towards Additively Manufactured Alumina Substrates for Printed Electronics Applications
Popis výsledku v původním jazyce
In this paper, the usability of 3D printed aluminum oxide ceramic, as a substrate for printed electronics is examined. The typical manufacturing process of ceramic substrates is based on the pressing or casting of ceramic green bodies followed by firing, which are problematic technologies for the realization of 3D-shaped electronics. Therefore, the fused filament fabrication method is utilized for the realization of the alumina substrate. The manufacturing process is closely examined and observations are reported. A sufficient resistivity of 3.79E10 14 Ω.cm was measured. Onto 3D printed substrates, conductive structures based on Ag-filled paste were printed using Direct-Write digital printing technology. The adhesion force of printed layers was 35 N.mm -2 . The usability of a 3D printed alumina for electronics was further demonstrated by full circuit realization with components assembly.
Název v anglickém jazyce
Towards Additively Manufactured Alumina Substrates for Printed Electronics Applications
Popis výsledku anglicky
In this paper, the usability of 3D printed aluminum oxide ceramic, as a substrate for printed electronics is examined. The typical manufacturing process of ceramic substrates is based on the pressing or casting of ceramic green bodies followed by firing, which are problematic technologies for the realization of 3D-shaped electronics. Therefore, the fused filament fabrication method is utilized for the realization of the alumina substrate. The manufacturing process is closely examined and observations are reported. A sufficient resistivity of 3.79E10 14 Ω.cm was measured. Onto 3D printed substrates, conductive structures based on Ag-filled paste were printed using Direct-Write digital printing technology. The adhesion force of printed layers was 35 N.mm -2 . The usability of a 3D printed alumina for electronics was further demonstrated by full circuit realization with components assembly.
Klasifikace
Druh
D - Stať ve sborníku
CEP obor
—
OECD FORD obor
20201 - Electrical and electronic engineering
Návaznosti výsledku
Projekt
<a href="/cs/project/TN02000067" target="_blank" >TN02000067: Nové směry v elektronice pro průmysl 4.0 a medicínu 4.0</a><br>
Návaznosti
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)
Ostatní
Rok uplatnění
2024
Kód důvěrnosti údajů
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Údaje specifické pro druh výsledku
Název statě ve sborníku
Proceedings of the International Spring Seminar on Electronics Technology
ISBN
979-8-3503-8547-2
ISSN
2161-2528
e-ISSN
2161-2536
Počet stran výsledku
5
Strana od-do
—
Název nakladatele
IEEE
Místo vydání
Piscaway
Místo konání akce
Prague, Czech Republic
Datum konání akce
15. 5. 2024
Typ akce podle státní příslušnosti
WRD - Celosvětová akce
Kód UT WoS článku
001283808200065