What is the Effect of Salt Spray Aging on the Reliability of Conductive Joints on E-textiles?

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F24%3A43972963" target="_blank" >RIV/49777513:23220/24:43972963 - isvavai.cz</a>

Výsledek na webu

<a href="https://ieeexplore.ieee.org/document/10693712" target="_blank" >https://ieeexplore.ieee.org/document/10693712</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1109/Diagnostika61830.2024.10693712" target="_blank" >10.1109/Diagnostika61830.2024.10693712</a>

Jazyk výsledku

angličtina

Název v původním jazyce

What is the Effect of Salt Spray Aging on the Reliability of Conductive Joints on E-textiles?

Popis výsledku v původním jazyce

This paper deals with the reliability of conductive joints between components and textile ribbons in salty environment. In the experiment three different contacting methods (low temperature soldering, non-conductive adhesive bonding, thermocompression bonding) were used. The experiment showed that in case of non-conductive adhesive bonding method, the viscosity of adhesive is crucial and samples with high viscosity adhesive are not applicable. The experiment also showed that low temperature soldering, non-conductive adhesive bonding using a suitable non-conductive adhesive or thermocompression method with the using of a conductive filament can be recommended and joints prepared by these methods are practically applicable in salty environment.

Název v anglickém jazyce

What is the Effect of Salt Spray Aging on the Reliability of Conductive Joints on E-textiles?

Popis výsledku anglicky

This paper deals with the reliability of conductive joints between components and textile ribbons in salty environment. In the experiment three different contacting methods (low temperature soldering, non-conductive adhesive bonding, thermocompression bonding) were used. The experiment showed that in case of non-conductive adhesive bonding method, the viscosity of adhesive is crucial and samples with high viscosity adhesive are not applicable. The experiment also showed that low temperature soldering, non-conductive adhesive bonding using a suitable non-conductive adhesive or thermocompression method with the using of a conductive filament can be recommended and joints prepared by these methods are practically applicable in salty environment.

Druh

D - Stať ve sborníku

CEP obor

—

OECD FORD obor

20201 - Electrical and electronic engineering

Projekt

—

Návaznosti

S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2024

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

2024 International Conference on Diagnostics in Electrical Engineering (Diagnostika) : /conference proceedings/

ISBN

979-8-3503-6149-0

ISSN

2464-7071

e-ISSN

2464-708X

Počet stran výsledku

4

Strana od-do

—

Název nakladatele

IEEE

Místo vydání

Piscataway

Místo konání akce

Pilsen, Czech Republic

Datum konání akce

3. 9. 2024

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

001345150300009