Real-Life Functional Tests of Conductive Joints of SMD Components on E-Textiles

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F22%3A43966056" target="_blank" >RIV/49777513:23220/22:43966056 - isvavai.cz</a>

Výsledek na webu

<a href="https://ieeexplore.ieee.org/document/9939515" target="_blank" >https://ieeexplore.ieee.org/document/9939515</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1109/ESTC55720.2022.9939515" target="_blank" >10.1109/ESTC55720.2022.9939515</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Real-Life Functional Tests of Conductive Joints of SMD Components on E-Textiles

Popis výsledku v původním jazyce

This article addresses the real-life functional research of electrically conductive joints of SMD components onto the electrically conductive textile stretchable ribbons. The four different connection techniques were used in the research: soldering, electrically conductive adhesive bonding, thermocompression, and non-conductive adhesive bonding. The 20 weeks of testing, including periodical weight training and washing, were realized. It can be concluded that soldering and both adhesive bonding technique are usable. The results showed that the electrical resistance of soldered samples was stable for the whole testing time and can be recommended. The results also showed that the electrical resistance of both adhesive bonded samples was growing at the first few testing cycles and stabilized for the rest many weeks of testing. It follows that also these adhesive bonding techniques can be recommended for some applications where the higher (but stable) joints resistance is acceptable.

Název v anglickém jazyce

Real-Life Functional Tests of Conductive Joints of SMD Components on E-Textiles

Popis výsledku anglicky

This article addresses the real-life functional research of electrically conductive joints of SMD components onto the electrically conductive textile stretchable ribbons. The four different connection techniques were used in the research: soldering, electrically conductive adhesive bonding, thermocompression, and non-conductive adhesive bonding. The 20 weeks of testing, including periodical weight training and washing, were realized. It can be concluded that soldering and both adhesive bonding technique are usable. The results showed that the electrical resistance of soldered samples was stable for the whole testing time and can be recommended. The results also showed that the electrical resistance of both adhesive bonded samples was growing at the first few testing cycles and stabilized for the rest many weeks of testing. It follows that also these adhesive bonding techniques can be recommended for some applications where the higher (but stable) joints resistance is acceptable.

Druh

D - Stať ve sborníku

CEP obor

—

OECD FORD obor

20201 - Electrical and electronic engineering

Projekt

—

Návaznosti

S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2022

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC 2022) : proceedings

ISBN

978-1-66548-947-8

ISSN

—

e-ISSN

—

Počet stran výsledku

5

Strana od-do

223-227

Název nakladatele

IEEE

Místo vydání

Piscataway

Místo konání akce

Sibiu, Romania

Datum konání akce

13. 9. 2022

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

001108538800041