The Influence of Nitrogen Atmosphere on Properties and Development of IMCs in Selected Lead-Free Solders

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F24%3A43972993" target="_blank" >RIV/49777513:23220/24:43972993 - isvavai.cz</a>

Výsledek na webu

<a href="https://ieeexplore.ieee.org/document/10693921" target="_blank" >https://ieeexplore.ieee.org/document/10693921</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1109/Diagnostika61830.2024.10693921" target="_blank" >10.1109/Diagnostika61830.2024.10693921</a>

Jazyk výsledku

angličtina

Název v původním jazyce

The Influence of Nitrogen Atmosphere on Properties and Development of IMCs in Selected Lead-Free Solders

Popis výsledku v původním jazyce

This study investigates the impact of different atmospheric conditions and plasma treatment on the wetting properties and intermetallic compound (IMC) thickness in lead-free soldering processes. Lead-free solders, primarily composed of high tin content, exhibit different wetting characteristics compared to traditional lead-based solders, influencing the quality and durability of solder joints. The use of an inert nitrogen atmosphere during soldering significantly improved wetting quality, reducing oxidation and enhancing solder flow. Plasma treatment further increased the wetted surface area by an average of 10%. The analysis also highlighted that thermal profiles had a more substantial effect on wetting quality and IMC properties than atmospheric conditions. Under nitrogen, IMC thickness remained stable across thermal profiles, while vacuum conditions showed increased IMC thickness and variability with high profile settings. These findings suggest that optimizing atmospheric conditions and thermal profiles is crucial for improving solder joint reliability in lead-free soldering, with plasma treatment showing potential as an additional enhancement technique. Future research will explore varying plasma treatment settings to further optimize solder joint quality.

Název v anglickém jazyce

The Influence of Nitrogen Atmosphere on Properties and Development of IMCs in Selected Lead-Free Solders

Popis výsledku anglicky

This study investigates the impact of different atmospheric conditions and plasma treatment on the wetting properties and intermetallic compound (IMC) thickness in lead-free soldering processes. Lead-free solders, primarily composed of high tin content, exhibit different wetting characteristics compared to traditional lead-based solders, influencing the quality and durability of solder joints. The use of an inert nitrogen atmosphere during soldering significantly improved wetting quality, reducing oxidation and enhancing solder flow. Plasma treatment further increased the wetted surface area by an average of 10%. The analysis also highlighted that thermal profiles had a more substantial effect on wetting quality and IMC properties than atmospheric conditions. Under nitrogen, IMC thickness remained stable across thermal profiles, while vacuum conditions showed increased IMC thickness and variability with high profile settings. These findings suggest that optimizing atmospheric conditions and thermal profiles is crucial for improving solder joint reliability in lead-free soldering, with plasma treatment showing potential as an additional enhancement technique. Future research will explore varying plasma treatment settings to further optimize solder joint quality.

Druh

D - Stať ve sborníku

CEP obor

—

OECD FORD obor

20201 - Electrical and electronic engineering

Projekt

—

Návaznosti

S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2024

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

2024 International Conference on Diagnostics in Electrical Engineering (Diagnostika) : /conference proceedings/

ISBN

979-8-3503-6149-0

ISSN

2464-7071

e-ISSN

2464-708X

Počet stran výsledku

4

Strana od-do

—

Název nakladatele

IEEE

Místo vydání

Piscataway

Místo konání akce

Pilsen, Czech Republic

Datum konání akce

3. 9. 2024

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

001345150300023