Technology for direct assembly of SMD components in stretchable textile electronics realized by printing

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F25%3A43975245" target="_blank" >RIV/49777513:23220/25:43975245 - isvavai.cz</a>

Výsledek na webu

<a href="https://iopscience.iop.org/article/10.1088/2058-8585/adba74" target="_blank" >https://iopscience.iop.org/article/10.1088/2058-8585/adba74</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1088/2058-8585/adba74" target="_blank" >10.1088/2058-8585/adba74</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Technology for direct assembly of SMD components in stretchable textile electronics realized by printing

Popis výsledku v původním jazyce

In this article, a novelty direct assembly method for stretchable e-textile electronics based on printed technologies is presented. Presented technology utilizes the assembly of components directly into the wet base layout paste, without any interfacing contact material (such as conductive adhesive). Such assembly reduces the number of technological steps and exhibits more reliable behavior, as the number of interfaces is reduced and the conductive material is highly stretchable. Components are encapsulated using flexible encapsulation and the whole electrical system is realized on a foil, which is then thermo-transferred to the textile substrate. Samples are subjected to the bend test and cyclic stretch tests. Direct assembly is proven to be robust enough, as its increase of resistance during cyclic stretch testing is much lower (17% after 500 cycles) than assembly with isotopically conductive adhesive. Direct assembly also exhibits rapid regeneration of resistance after the end of mechanical load. In addition, a low and sufficient contact resistance of around 100 mΩ is achieved.

Název v anglickém jazyce

Technology for direct assembly of SMD components in stretchable textile electronics realized by printing

Popis výsledku anglicky

In this article, a novelty direct assembly method for stretchable e-textile electronics based on printed technologies is presented. Presented technology utilizes the assembly of components directly into the wet base layout paste, without any interfacing contact material (such as conductive adhesive). Such assembly reduces the number of technological steps and exhibits more reliable behavior, as the number of interfaces is reduced and the conductive material is highly stretchable. Components are encapsulated using flexible encapsulation and the whole electrical system is realized on a foil, which is then thermo-transferred to the textile substrate. Samples are subjected to the bend test and cyclic stretch tests. Direct assembly is proven to be robust enough, as its increase of resistance during cyclic stretch testing is much lower (17% after 500 cycles) than assembly with isotopically conductive adhesive. Direct assembly also exhibits rapid regeneration of resistance after the end of mechanical load. In addition, a low and sufficient contact resistance of around 100 mΩ is achieved.

Druh

J_imp - Článek v periodiku v databázi Web of Science

CEP obor

—

OECD FORD obor

20201 - Electrical and electronic engineering

Projekt

—

Návaznosti

S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2025

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název periodika

Flexible and Printed Electronics

ISSN

2058-8585

e-ISSN

2058-8585

Svazek periodika

10

Číslo periodika v rámci svazku

1

Stát vydavatele periodika

GB - Spojené království Velké Británie a Severního Irska

Počet stran výsledku

15

Strana od-do

nestránkováno

Kód UT WoS článku

001438597800001

EID výsledku v databázi Scopus

2-s2.0-86000453245