Examination of Wet Assembling Methods in Printed Flexible Electronics

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F22%3A43965456" target="_blank" >RIV/49777513:23220/22:43965456 - isvavai.cz</a>

Výsledek na webu

<a href="https://ieeexplore.ieee.org/document/9812763" target="_blank" >https://ieeexplore.ieee.org/document/9812763</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1109/ISSE54558.2022.9812763" target="_blank" >10.1109/ISSE54558.2022.9812763</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Examination of Wet Assembling Methods in Printed Flexible Electronics

Popis výsledku v původním jazyce

This paper examines two methods of assembling electronics SMD components on flexible substrates with low-temperature resistance. As a contact medium for interconnection between component and conductive pattern, conductive adhesive MG Chemicals 8331S-15G or conductive Ag printing paste DuPont PE 874 was used. The contact resistance of samples was measured after the assembling process and then mechanical tests were performed. Samples were subjected to a bend test and a rapid change of temperature in the shock chamber. Tests have shown that Ag paste can withstand high mechanical and temperature stress due to its stretchability and can partly return to its previous state after mechanical stress is released. On the other hand, conductive adhesive, which is rigid, tends to fail under high mechanical and temperature stress. Ag paste shows great assumptions to be used in the field of flexible or even stretchable electronics as a contact medium.

Název v anglickém jazyce

Examination of Wet Assembling Methods in Printed Flexible Electronics

Popis výsledku anglicky

This paper examines two methods of assembling electronics SMD components on flexible substrates with low-temperature resistance. As a contact medium for interconnection between component and conductive pattern, conductive adhesive MG Chemicals 8331S-15G or conductive Ag printing paste DuPont PE 874 was used. The contact resistance of samples was measured after the assembling process and then mechanical tests were performed. Samples were subjected to a bend test and a rapid change of temperature in the shock chamber. Tests have shown that Ag paste can withstand high mechanical and temperature stress due to its stretchability and can partly return to its previous state after mechanical stress is released. On the other hand, conductive adhesive, which is rigid, tends to fail under high mechanical and temperature stress. Ag paste shows great assumptions to be used in the field of flexible or even stretchable electronics as a contact medium.

Druh

D - Stať ve sborníku

CEP obor

—

OECD FORD obor

20201 - Electrical and electronic engineering

Projekt

<a href="/cs/project/EF18_069%2F0009855" target="_blank" >EF18_069/0009855: Elektrotechnické technologie s vysokým podílem vestavěné inteligence</a><br>

Návaznosti

P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>S - Specificky vyzkum na vysokych skolach<br>I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Rok uplatnění

2022

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

2022 45th International Spring Seminar on Electronics Technology : /proceedings/

ISBN

978-1-66546-589-2

ISSN

2161-2536

e-ISSN

2161-2536

Počet stran výsledku

6

Strana od-do

1-6

Název nakladatele

IEEE

Místo vydání

Piscaway

Místo konání akce

Vienna, Austria

Datum konání akce

11. 5. 2022

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

000853642200013