Assembly method and its influence on electrically conductive adhesives and solder pastes joints durability

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F15%3A00300022" target="_blank" >RIV/68407700:21230/15:00300022 - isvavai.cz</a>

Výsledek na webu

<a href="http://ieeexplore.ieee.org/xpl/login.jsp?tp=&arnumber=7248012&url=http%3A%2F%2Fieeexplore.ieee.org%2Fiel7%2F7229501%2F7247949%2F07248012.pdf%3Farnumber%3D7248012" target="_blank" >http://ieeexplore.ieee.org/xpl/login.jsp?tp=&arnumber=7248012&url=http%3A%2F%2Fieeexplore.ieee.org%2Fiel7%2F7229501%2F7247949%2F07248012.pdf%3Farnumber%3D7248012</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1109/ISSE.2015.7248012" target="_blank" >10.1109/ISSE.2015.7248012</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Assembly method and its influence on electrically conductive adhesives and solder pastes joints durability

Popis výsledku v původním jazyce

This article is focused on comparing of different assembly methods, particularly stencil printing and dispensing paste deposition and compares lead and lead-free solder pastes with one-component and two-component epoxy based electrically conductive adhesives. The evaluation method is based on resistance measurement after accelerated stress tests. The aging was conducted using automatic mechanical cyclic stress machine tester and joint resistance to environment was tested using long term temperature straining and combined humidity and temperature straining. Shear strength measurement was done in order to determine mechanical stability of the connection.

Název v anglickém jazyce

Assembly method and its influence on electrically conductive adhesives and solder pastes joints durability

Popis výsledku anglicky

This article is focused on comparing of different assembly methods, particularly stencil printing and dispensing paste deposition and compares lead and lead-free solder pastes with one-component and two-component epoxy based electrically conductive adhesives. The evaluation method is based on resistance measurement after accelerated stress tests. The aging was conducted using automatic mechanical cyclic stress machine tester and joint resistance to environment was tested using long term temperature straining and combined humidity and temperature straining. Shear strength measurement was done in order to determine mechanical stability of the connection.

Druh

D - Stať ve sborníku

CEP obor

JA - Elektronika a optoelektronika, elektrotechnika

OECD FORD obor

—

Projekt

—

Návaznosti

V - Vyzkumna aktivita podporovana z jinych verejnych zdroju

Rok uplatnění

2015

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

38th International Spring Seminar on Electronics Technology (ISSE 2015)

ISBN

978-1-4799-8860-0

ISSN

—

e-ISSN

—

Počet stran výsledku

5

Strana od-do

310-314

Název nakladatele

Institute of Electrical and Electronics Engineers

Místo vydání

New York

Místo konání akce

Eger

Datum konání akce

6. 5. 2015

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

000374113000063