Mechanical Strength of Aged Solder Joints: Impact of Plasma Treatment

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F25%3A43975936" target="_blank" >RIV/49777513:23220/25:43975936 - isvavai.cz</a>

Výsledek na webu

<a href="https://ieeexplore.ieee.org/document/11120910" target="_blank" >https://ieeexplore.ieee.org/document/11120910</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1109/ISSE65583.2025.11120910" target="_blank" >10.1109/ISSE65583.2025.11120910</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Mechanical Strength of Aged Solder Joints: Impact of Plasma Treatment

Popis výsledku v původním jazyce

The reliability of solder joints, crucial for electronic assemblies, is influenced by factors including intermetallic compound (IMC) growth during aging and surface properties. This study investigated the impact of atmospheric plasma pre-treatment on the shear strength and IMC formation of aged (thermal aging and thermal shock) SAC305 solder joints on various PCB finishes (Cu, ImT, HASL, ENIG). Shear testing revealed that plasma treatment had a limited effect on mechanical strength under the applied test conditions. Fracture mode analysis indicated that failures predominantly occurred at the component’s lead metallization, suggesting that component quality was the limiting factor, masking potential effects of the plasma treatment applied to the PCB pads. Thermal shock aging was observed to be more detrimental to joint strength than thermal aging, particularly affecting the component-level integrity. IMC analysis showed expected growth with thermal aging. Plasma treatment had negligible impact on IMC thickness for ENIG finish, while an unexpected trend of reduced IMC thickness was observed for HASL finish, warranting further investigation. The study highlights the critical role of component robustness in reliability testing and suggests its potential to overshadow the influence of PCB surface treatments.

Název v anglickém jazyce

Mechanical Strength of Aged Solder Joints: Impact of Plasma Treatment

Popis výsledku anglicky

The reliability of solder joints, crucial for electronic assemblies, is influenced by factors including intermetallic compound (IMC) growth during aging and surface properties. This study investigated the impact of atmospheric plasma pre-treatment on the shear strength and IMC formation of aged (thermal aging and thermal shock) SAC305 solder joints on various PCB finishes (Cu, ImT, HASL, ENIG). Shear testing revealed that plasma treatment had a limited effect on mechanical strength under the applied test conditions. Fracture mode analysis indicated that failures predominantly occurred at the component’s lead metallization, suggesting that component quality was the limiting factor, masking potential effects of the plasma treatment applied to the PCB pads. Thermal shock aging was observed to be more detrimental to joint strength than thermal aging, particularly affecting the component-level integrity. IMC analysis showed expected growth with thermal aging. Plasma treatment had negligible impact on IMC thickness for ENIG finish, while an unexpected trend of reduced IMC thickness was observed for HASL finish, warranting further investigation. The study highlights the critical role of component robustness in reliability testing and suggests its potential to overshadow the influence of PCB surface treatments.

Druh

D - Stať ve sborníku

CEP obor

—

OECD FORD obor

20201 - Electrical and electronic engineering

Projekt

—

Návaznosti

S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2025

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

2025 International Spring Seminar on Electronics Technology (ISSE)

ISBN

979-8-3315-1216-3

ISSN

2161-2528

e-ISSN

2161-2536

Počet stran výsledku

6

Strana od-do

1-6

Název nakladatele

IEEE

Místo vydání

Piscaway

Místo konání akce

Budapešť, Hungary

Datum konání akce

14. 5. 2025

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

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