Power module for solid-state circuit breaker

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F25%3A43978510" target="_blank" >RIV/49777513:23220/25:43978510 - isvavai.cz</a>

Výsledek na webu

<a href="https://register.epo.org/application?number=EP24713379&tab=main" target="_blank" >https://register.epo.org/application?number=EP24713379&tab=main</a>

DOI - Digital Object Identifier

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Jazyk výsledku

angličtina

Název v původním jazyce

Power module for solid-state circuit breaker

Popis výsledku v původním jazyce

A power module for a solid-state circuit breaker includes a heat sink (1) made of a dielectric material having thermal conductivity over 20 W/m/K provided on its surface with an electrically conductive power pattern (3). A bi-directional power electronics switch (5) is placed on the electrically conductive power pattern (3) and connected by an electrically conductive power connection (2). The electrically conductive power pattern (3) is interconnected with auxiliary dielectric substrates (9) on which electrically conductive non-power patterns (18) interconnecting non-power electronics circuits (7) are placed. At least the heat sink (1), the-power electronics switch (5), the auxiliary dielectric substrates (9), and the non-power electronics circuits (7) are jointly included in a monolithic multilayer structure elements of which are connected through entire contact surfaces. The heat sink (1) may be mechanically and thermally connected with an auxiliary heat sink (14) made of electrically conductive material having thermal conductivity over 180 W/m/K. Connection is made of a contact layer (20) compensating different coefficients of thermal expansion of the heat sink (1) and of the auxiliary heat sink (14).

Název v anglickém jazyce

Power module for solid-state circuit breaker

Popis výsledku anglicky

A power module for a solid-state circuit breaker includes a heat sink (1) made of a dielectric material having thermal conductivity over 20 W/m/K provided on its surface with an electrically conductive power pattern (3). A bi-directional power electronics switch (5) is placed on the electrically conductive power pattern (3) and connected by an electrically conductive power connection (2). The electrically conductive power pattern (3) is interconnected with auxiliary dielectric substrates (9) on which electrically conductive non-power patterns (18) interconnecting non-power electronics circuits (7) are placed. At least the heat sink (1), the-power electronics switch (5), the auxiliary dielectric substrates (9), and the non-power electronics circuits (7) are jointly included in a monolithic multilayer structure elements of which are connected through entire contact surfaces. The heat sink (1) may be mechanically and thermally connected with an auxiliary heat sink (14) made of electrically conductive material having thermal conductivity over 180 W/m/K. Connection is made of a contact layer (20) compensating different coefficients of thermal expansion of the heat sink (1) and of the auxiliary heat sink (14).

Druh

P - Patent

CEP obor

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OECD FORD obor

20201 - Electrical and electronic engineering

Projekt

<a href="/cs/project/TN02000054" target="_blank" >TN02000054: Národní centrum kompetence inženýrství pozemních vozidel Josefa Božka</a><br>

Návaznosti

P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)

Rok uplatnění

2025

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Číslo patentu nebo vzoru

EP4490780

Vydavatel

EPO_1 -

Název vydavatele

European Patent Office

Místo vydání

Munich, The Hague, Berlin, Vienna, Brussels

Stát vydání

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Datum přijetí

14. 5. 2025

Název vlastníka

Západočeská univerzita v Plzni (IČ: 49777513)

Způsob využití

A - Výsledek využívá pouze poskytovatel

Druh možnosti využití

A - K využití výsledku jiným subjektem je vždy nutné nabytí licence