Vývoj teploty tenké vrstvy během magnetronového naprašování

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23520%2F06%3A00000130" target="_blank" >RIV/49777513:23520/06:00000130 - isvavai.cz</a>

Výsledek na webu

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DOI - Digital Object Identifier

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Jazyk výsledku

angličtina

Název v původním jazyce

Evolution of film temperature during magnetron sputtering

Popis výsledku v původním jazyce

We report on the results of measurement of the temperature TFsurf which developed on the surface of films deposited by magnetron sputtering of chromium and copper targets on cooling and non-cooling silicon substrates. The TFsurf and substrate temperature(TS) were simultaneously measured using high-resolution IR camera and thermocouple, respectively. We revealed that the TFsurf steeply grows, keeps constant when it achieves saturation level, and rapidly drops to the value of the TS after stopping the deposition. At the same time, the TS either does not change for the case of cooling substrate or increases to a certain level for non-cooling substrate. However, in both cases the TS remains several times lower than the TFsurf. The TFsurf is proportional to the flux of energy delivered to the growth surface by sputtered atoms and other fast particles, weakly depends on the depositing metal and can achieve several hundreds of °C.

Název v anglickém jazyce

Evolution of film temperature during magnetron sputtering

Popis výsledku anglicky

We report on the results of measurement of the temperature TFsurf which developed on the surface of films deposited by magnetron sputtering of chromium and copper targets on cooling and non-cooling silicon substrates. The TFsurf and substrate temperature(TS) were simultaneously measured using high-resolution IR camera and thermocouple, respectively. We revealed that the TFsurf steeply grows, keeps constant when it achieves saturation level, and rapidly drops to the value of the TS after stopping the deposition. At the same time, the TS either does not change for the case of cooling substrate or increases to a certain level for non-cooling substrate. However, in both cases the TS remains several times lower than the TFsurf. The TFsurf is proportional to the flux of energy delivered to the growth surface by sputtered atoms and other fast particles, weakly depends on the depositing metal and can achieve several hundreds of °C.

Druh

J_x - Nezařazeno - Článek v odborném periodiku (Jimp, Jsc a Jost)

CEP obor

BL - Fyzika plasmatu a výboje v plynech

OECD FORD obor

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Projekt

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Návaznosti

Z - Vyzkumny zamer (s odkazem do CEZ)

Rok uplatnění

2006

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název periodika

Journal of Vacuum Science and Technology A

ISSN

0734-2101

e-ISSN

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Svazek periodika

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Číslo periodika v rámci svazku

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Stát vydavatele periodika

US - Spojené státy americké

Počet stran výsledku

8

Strana od-do

1083

Kód UT WoS článku

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EID výsledku v databázi Scopus

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