ALICE ITS3: the first truly cylindrical inner tracker

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F61389005%3A_____%2F24%3A00584996" target="_blank" >RIV/61389005:_____/24:00584996 - isvavai.cz</a>

Výsledek na webu

<a href="https://doi.org/10.22323/1.449.0538" target="_blank" >https://doi.org/10.22323/1.449.0538</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.22323/1.449.0538" target="_blank" >10.22323/1.449.0538</a>

Jazyk výsledku

angličtina

Název v původním jazyce

ALICE ITS3: the first truly cylindrical inner tracker

Popis výsledku v původním jazyce

During the next LHC Long Shutdown 3 in 2026-2028, the ALICE Collaboration plans to replace the three innermost layers of the current Inner Tracking System (ITS) with truly cylindrical layers, made of wafer-scale, thin (< 50 μm), and bent Monolithic Active Pixel Sensors (MAPS) that will be produced with the 65 nm CMOS imaging process. To fabricate the wafer-scale sensors, a technology, called stitching, is utilized to 'stitch' small reticles and build sensors up to 300 mm in length in a single wafer. The upgrade aims to decrease the material budget of the innermost layers from the present 0.35% of X0/layer to 0.05% of X0/layer, essentially reducing it to the silicon contribution only. The upgraded ITS will improve the pointing resolution in the transverse plane by a factor of 2 and increase the reconstruction efficiency for low-pT tracks. The construction of this detector encompasses many cutting-edge R&D efforts, for instance, production and characterization of the MAPS in the 65 nm CMOS process, fabrication of the stitched wafer-scale MAPS, and development of an ultra-light detector mechanics and a new air cooling system. This contribution provides a brief overview of the ALICE ITS3 detector and the R&D achievements, mentioned above.

Název v anglickém jazyce

ALICE ITS3: the first truly cylindrical inner tracker

Popis výsledku anglicky

During the next LHC Long Shutdown 3 in 2026-2028, the ALICE Collaboration plans to replace the three innermost layers of the current Inner Tracking System (ITS) with truly cylindrical layers, made of wafer-scale, thin (< 50 μm), and bent Monolithic Active Pixel Sensors (MAPS) that will be produced with the 65 nm CMOS imaging process. To fabricate the wafer-scale sensors, a technology, called stitching, is utilized to 'stitch' small reticles and build sensors up to 300 mm in length in a single wafer. The upgrade aims to decrease the material budget of the innermost layers from the present 0.35% of X0/layer to 0.05% of X0/layer, essentially reducing it to the silicon contribution only. The upgraded ITS will improve the pointing resolution in the transverse plane by a factor of 2 and increase the reconstruction efficiency for low-pT tracks. The construction of this detector encompasses many cutting-edge R&D efforts, for instance, production and characterization of the MAPS in the 65 nm CMOS process, fabrication of the stitched wafer-scale MAPS, and development of an ultra-light detector mechanics and a new air cooling system. This contribution provides a brief overview of the ALICE ITS3 detector and the R&D achievements, mentioned above.

Druh

D - Stať ve sborníku

CEP obor

—

OECD FORD obor

10304 - Nuclear physics

Projekt

<a href="/cs/project/LM2023040" target="_blank" >LM2023040: Výzkumná infrastruktura pro experimenty v CERN</a><br>

Návaznosti

I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Rok uplatnění

2024

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

Proceedings of Science

ISBN

—

ISSN

1824-8039

e-ISSN

—

Počet stran výsledku

6

Strana od-do

538

Název nakladatele

Sissa Medilab srl

Místo vydání

Trieste

Místo konání akce

Hamburg

Datum konání akce

21. 8. 2023

Typ akce podle státní příslušnosti

EUR - Evropská akce

Kód UT WoS článku

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