ITS3, the ALICE Vertex Detector for LHC Run 4

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F61389005%3A_____%2F24%3A00588295" target="_blank" >RIV/61389005:_____/24:00588295 - isvavai.cz</a>

Výsledek na webu

<a href="https://doi.org/10.22323/1.448.0033" target="_blank" >https://doi.org/10.22323/1.448.0033</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.22323/1.448.0033" target="_blank" >10.22323/1.448.0033</a>

Jazyk výsledku

angličtina

Název v původním jazyce

ITS3, the ALICE Vertex Detector for LHC Run 4

Popis výsledku v původním jazyce

During LHC Long Shutdown 3 (2026–2028), the ALICE Collaboration plans to upgrade the innermost layers of the current Inner Tracking System detector (ITS) with a novel vertex detector ITS3. The concept of this new vertex detector is based on ultra-thin (<50μm), wafer-scale (up to about 10×26 cm2 large) Monolithic Active Pixel Sensors (MAPS) that are fabricated using the 65 nm CMOS process. Such sensors can be bent to radii as small as 18 mm and can be utilized to construct truly cylindrical-detector shells with an unprecedently low material budget, 0.05% ????0 per layer only. The development of this detector includes a number of cutting-edge R&D efforts, including the qualification of MAPS in 65 nm, the development of wafer-scale stitched MAPS, the concept of bent MAPS, ultra-light mechanics based on carbon foam supports, and air cooling. This contribution provides an overview of the ALICE ITS3 detector and of the R&D achievements, including: the validation of the 65 nm technology for particle tracking and radiation hardness, the achievements in terms of bending and flexibility, the integration of wafer-scale silicon detectors, and the production of the first MOnolithic Stitched Sensor (MOSS).

Název v anglickém jazyce

ITS3, the ALICE Vertex Detector for LHC Run 4

Popis výsledku anglicky

During LHC Long Shutdown 3 (2026–2028), the ALICE Collaboration plans to upgrade the innermost layers of the current Inner Tracking System detector (ITS) with a novel vertex detector ITS3. The concept of this new vertex detector is based on ultra-thin (<50μm), wafer-scale (up to about 10×26 cm2 large) Monolithic Active Pixel Sensors (MAPS) that are fabricated using the 65 nm CMOS process. Such sensors can be bent to radii as small as 18 mm and can be utilized to construct truly cylindrical-detector shells with an unprecedently low material budget, 0.05% ????0 per layer only. The development of this detector includes a number of cutting-edge R&D efforts, including the qualification of MAPS in 65 nm, the development of wafer-scale stitched MAPS, the concept of bent MAPS, ultra-light mechanics based on carbon foam supports, and air cooling. This contribution provides an overview of the ALICE ITS3 detector and of the R&D achievements, including: the validation of the 65 nm technology for particle tracking and radiation hardness, the achievements in terms of bending and flexibility, the integration of wafer-scale silicon detectors, and the production of the first MOnolithic Stitched Sensor (MOSS).

Druh

D - Stať ve sborníku

CEP obor

—

OECD FORD obor

10304 - Nuclear physics

Projekt

<a href="/cs/project/LM2023040" target="_blank" >LM2023040: Výzkumná infrastruktura pro experimenty v CERN</a><br>

Návaznosti

I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Rok uplatnění

2024

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

Proceedings of Science

ISBN

—

ISSN

1824-8039

e-ISSN

—

Počet stran výsledku

7

Strana od-do

033

Název nakladatele

Sissa Medilab srl

Místo vydání

Trieste

Místo konání akce

Genova

Datum konání akce

16. 10. 2023

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

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