Microstructuring of metallic layers for sensor applications

Kód výsledku v IS VaVaI

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Výsledek na webu

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DOI - Digital Object Identifier

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Jazyk výsledku

angličtina

Název v původním jazyce

Microstructuring of metallic layers for sensor applications

Popis výsledku v původním jazyce

This contribution deals with a patterning of thin metallic layers using the masking technique by electron beam lithography. It is mainly concentrated on procedures to prepare finger structure in thin Gold layer on electrically isolated Silicon wafer. Both positive and negative tone resists are used for patterning. The thin layer is structured by the wet etching or by the lift-off technique. The prepared structures are intended to be used as a conductivity sensor for a variety of sensor applications. Patterning of the thin layer is performed by the e-beam writer with shaped rectangular beam BS600 by direct writing (without the glass photo mask). Besides the main technology process based on the direct-write e-beam lithography, other auxiliary issues arealso discussed such as stitching and overlay precision of the process, throughput of this approach, issues of the thin layer adhesion on the substrate, inter-operation control and measurement techniques.

Název v anglickém jazyce

Microstructuring of metallic layers for sensor applications

Popis výsledku anglicky

This contribution deals with a patterning of thin metallic layers using the masking technique by electron beam lithography. It is mainly concentrated on procedures to prepare finger structure in thin Gold layer on electrically isolated Silicon wafer. Both positive and negative tone resists are used for patterning. The thin layer is structured by the wet etching or by the lift-off technique. The prepared structures are intended to be used as a conductivity sensor for a variety of sensor applications. Patterning of the thin layer is performed by the e-beam writer with shaped rectangular beam BS600 by direct writing (without the glass photo mask). Besides the main technology process based on the direct-write e-beam lithography, other auxiliary issues arealso discussed such as stitching and overlay precision of the process, throughput of this approach, issues of the thin layer adhesion on the substrate, inter-operation control and measurement techniques.

Druh

D - Stať ve sborníku

CEP obor

JA - Elektronika a optoelektronika, elektrotechnika

OECD FORD obor

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Projekt

Výsledek vznikl pri realizaci vícero projektů. Více informací v záložce Projekty.

Návaznosti

P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)

Rok uplatnění

2013

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

METAL 2013 Conference Proceedings. 22nd International Conference on Metallurgy and Materials

ISBN

978-80-87294-41-3

ISSN

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e-ISSN

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Počet stran výsledku

5

Strana od-do

1069-1073

Název nakladatele

TANGER Ltd

Místo vydání

Ostrava

Místo konání akce

Brno

Datum konání akce

15. 5. 2013

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

000333163100174