Automated System for Optical Inspection of Defects in Resist-coated Non-patterned Wafer
Identifikátory výsledku
Kód výsledku v IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68081731%3A_____%2F20%3A00532029" target="_blank" >RIV/68081731:_____/20:00532029 - isvavai.cz</a>
Výsledek na webu
<a href="http://journals.yu.edu.jo/jjp/JJPIssues/Vol13No2pdf2020/1.html" target="_blank" >http://journals.yu.edu.jo/jjp/JJPIssues/Vol13No2pdf2020/1.html</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.47011/13.2.1" target="_blank" >10.47011/13.2.1</a>
Alternativní jazyky
Jazyk výsledku
angličtina
Název v původním jazyce
Automated System for Optical Inspection of Defects in Resist-coated Non-patterned Wafer
Popis výsledku v původním jazyce
Quality control of the resist coating on a silicon wafer is one of the major tasks prior to the exposition of patterns into the resist layer. Thus, the ability to inspect and identify the physical defect in the resist layer plays an important role. The absence of any unwanted defect in resist is an ultimate requirement for preparation of precise and functional micro- or nano-patterned surfaces. Currently used wafer inspection systems are mostly utilized in semiconductor or microelectronic industry to inspect non-patterned or patterned wafers (integrated circuits, photomasks,. etc.) in order to achieve high yield production. Typically, they are based on acoustic micro-imaging, optical imaging or electron microscopy. This paper presents the design of a custom optical-based inspection device for small batch lithography production that allows scanning a wafer surface with an optical camera and by analyzing the captured images to determine the coordinates (X, Y), the size and the type of the defects in the resist layer. In addition, software responsible for driving the scanning device and for advanced image processing is presented.
Název v anglickém jazyce
Automated System for Optical Inspection of Defects in Resist-coated Non-patterned Wafer
Popis výsledku anglicky
Quality control of the resist coating on a silicon wafer is one of the major tasks prior to the exposition of patterns into the resist layer. Thus, the ability to inspect and identify the physical defect in the resist layer plays an important role. The absence of any unwanted defect in resist is an ultimate requirement for preparation of precise and functional micro- or nano-patterned surfaces. Currently used wafer inspection systems are mostly utilized in semiconductor or microelectronic industry to inspect non-patterned or patterned wafers (integrated circuits, photomasks,. etc.) in order to achieve high yield production. Typically, they are based on acoustic micro-imaging, optical imaging or electron microscopy. This paper presents the design of a custom optical-based inspection device for small batch lithography production that allows scanning a wafer surface with an optical camera and by analyzing the captured images to determine the coordinates (X, Y), the size and the type of the defects in the resist layer. In addition, software responsible for driving the scanning device and for advanced image processing is presented.
Klasifikace
Druh
J<sub>imp</sub> - Článek v periodiku v databázi Web of Science
CEP obor
—
OECD FORD obor
20205 - Automation and control systems
Návaznosti výsledku
Projekt
<a href="/cs/project/FV10618" target="_blank" >FV10618: Mikro a nano optika pro řízené směrování světla z LED zdrojů</a><br>
Návaznosti
I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace
Ostatní
Rok uplatnění
2020
Kód důvěrnosti údajů
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Údaje specifické pro druh výsledku
Název periodika
Jordan Journal of Physics
ISSN
1994-7607
e-ISSN
—
Svazek periodika
13
Číslo periodika v rámci svazku
2
Stát vydavatele periodika
JO - Jordánské hášimovské království
Počet stran výsledku
8
Strana od-do
93-100
Kód UT WoS článku
000559771600001
EID výsledku v databázi Scopus
2-s2.0-85091405823