Automated defectoscopy of thin poly (methyl methacrylate) layers

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68081731%3A_____%2F22%3A00567284" target="_blank" >RIV/68081731:_____/22:00567284 - isvavai.cz</a>

Výsledek na webu

<a href="http://147.228.94.30/images/PDF/Rocnik2020/Cislo1_2022/r16c1c7.pdf" target="_blank" >http://147.228.94.30/images/PDF/Rocnik2020/Cislo1_2022/r16c1c7.pdf</a>

DOI - Digital Object Identifier

—

Jazyk výsledku

angličtina

Název v původním jazyce

Automated defectoscopy of thin poly (methyl methacrylate) layers

Popis výsledku v původním jazyce

In the electron beam lithography process, one of the initial steps is to coat the substrate (i.e., the silicon wafer) with a thin layer of polymer resist. During the coating process, defects in the thin layer can occur, which can affect the exposure and therefore the functionality of the final nanostructure. By checking the quality of the deposited polymer layer prior to exposure, these defect sites can be avoided. This process can be done manually using a visible-light microscope, but it is a time-consuming process and subject to a possible human error. In the framework of this project, a fully automated device has been developed that can detect and identifies these using computer vision. It is a scanning device that, by combining three stepper motors and an optical camera, takes images of the desired area of the wafer and then analyses these with the help of artificial intelligence. The user is then provided with a document in which the size, position and type of each defect found is recorded.

Název v anglickém jazyce

Automated defectoscopy of thin poly (methyl methacrylate) layers

Popis výsledku anglicky

In the electron beam lithography process, one of the initial steps is to coat the substrate (i.e., the silicon wafer) with a thin layer of polymer resist. During the coating process, defects in the thin layer can occur, which can affect the exposure and therefore the functionality of the final nanostructure. By checking the quality of the deposited polymer layer prior to exposure, these defect sites can be avoided. This process can be done manually using a visible-light microscope, but it is a time-consuming process and subject to a possible human error. In the framework of this project, a fully automated device has been developed that can detect and identifies these using computer vision. It is a scanning device that, by combining three stepper motors and an optical camera, takes images of the desired area of the wafer and then analyses these with the help of artificial intelligence. The user is then provided with a document in which the size, position and type of each defect found is recorded.

Druh

J_ost - Ostatní články v recenzovaných periodicích

CEP obor

—

OECD FORD obor

20205 - Automation and control systems

Projekt

—

Návaznosti

I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Rok uplatnění

2022

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název periodika

Electroscope

ISSN

1802-4564

e-ISSN

—

Svazek periodika

2022

Číslo periodika v rámci svazku

1

Stát vydavatele periodika

CZ - Česká republika

Počet stran výsledku

7

Strana od-do

8

Kód UT WoS článku

—

EID výsledku v databázi Scopus

—