Qualification of 1030 nm ultra-short-pulsed laser for glass sheet treatment in TGV process

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68378271%3A_____%2F22%3A00568504" target="_blank" >RIV/68378271:_____/22:00568504 - isvavai.cz</a>

Výsledek na webu

<a href="https://www.spiedigitallibrary.org/conference-proceedings-of-spie/11988/2610143/Qualification-of-1030-nm-ultra-short-pulsed-laser-for-glass/10.1117/12.2610143.short?SSO=1" target="_blank" >https://www.spiedigitallibrary.org/conference-proceedings-of-spie/11988/2610143/Qualification-of-1030-nm-ultra-short-pulsed-laser-for-glass/10.1117/12.2610143.short?SSO=1</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1117/12.2610143" target="_blank" >10.1117/12.2610143</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Qualification of 1030 nm ultra-short-pulsed laser for glass sheet treatment in TGV process

Popis výsledku v původním jazyce

Glass sheets with ~ 0.1 mm thickness are a promising material from which interposers for high density chip packaging can be produced due to its electrical and mechanical properties. For successful application in microelectronics, it is necessary to develop a way of efficient, high-speed production of interconnecting holes through such glass substrate, socalled through glass vias (TGVs). One of the most promising technique is Laser-Induced Deep Etching (LIDE), where picosecond laser is used to modified particular areas on the glass substrate. Then, using wet etching process, the area exposed to the laser will be etched more quickly than unexposed area. However, effective and large-scale glass modification often requires use of high-energy pulsed UV laser source, which unnecessary complicates the whole application. Here we present effective preparation of treated glass substrate using Yb:YAG laser at its fundamental wavelength 1030 nm, which is capable to overcome such disadvantage.

Název v anglickém jazyce

Qualification of 1030 nm ultra-short-pulsed laser for glass sheet treatment in TGV process

Popis výsledku anglicky

Glass sheets with ~ 0.1 mm thickness are a promising material from which interposers for high density chip packaging can be produced due to its electrical and mechanical properties. For successful application in microelectronics, it is necessary to develop a way of efficient, high-speed production of interconnecting holes through such glass substrate, socalled through glass vias (TGVs). One of the most promising technique is Laser-Induced Deep Etching (LIDE), where picosecond laser is used to modified particular areas on the glass substrate. Then, using wet etching process, the area exposed to the laser will be etched more quickly than unexposed area. However, effective and large-scale glass modification often requires use of high-energy pulsed UV laser source, which unnecessary complicates the whole application. Here we present effective preparation of treated glass substrate using Yb:YAG laser at its fundamental wavelength 1030 nm, which is capable to overcome such disadvantage.

Druh

D - Stať ve sborníku

CEP obor

—

OECD FORD obor

10306 - Optics (including laser optics and quantum optics)

Projekt

Výsledek vznikl pri realizaci vícero projektů. Více informací v záložce Projekty.

Návaznosti

P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)

Rok uplatnění

2022

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXVII

ISBN

978-1-5106-4848-7

ISSN

0277-786X

e-ISSN

—

Počet stran výsledku

12

Strana od-do

1198804

Název nakladatele

SPIE

Místo vydání

Bellingham

Místo konání akce

San Francisco

Datum konání akce

22. 1. 2022

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

000844454100003