Characterisation of Microorganism from Individual Layers of the Building Envelope (ETICS) and Methods of Their Sampling
Identifikátory výsledku
Kód výsledku v IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21110%2F15%3A00301844" target="_blank" >RIV/68407700:21110/15:00301844 - isvavai.cz</a>
Výsledek na webu
<a href="http://www.scientific.net/KEM.714.196" target="_blank" >http://www.scientific.net/KEM.714.196</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.4028/www.scientific.net/KEM.714.196" target="_blank" >10.4028/www.scientific.net/KEM.714.196</a>
Alternativní jazyky
Jazyk výsledku
angličtina
Název v původním jazyce
Characterisation of Microorganism from Individual Layers of the Building Envelope (ETICS) and Methods of Their Sampling
Popis výsledku v původním jazyce
The current situation of contact insulation systems from 80s and 90s is fallback and they do not correspond with current valid technical norm. The almost case is necessary refurbishment of building envelope or performance of additional insulation. The question "what ETICS hides inside" occurs, and whether the removal is necessary or whether the making of additional insulation directly on the current one is possible. This is connected with occurring of growth microorganism especially mold through building envelope. Our article is about problem of mold through building envelope esp. ETICS in territory of Czech Republic. The results show that the whole ETICS is contaminated with mold and there is a risk that if there are appropriate conditions for the fungus in building envelope and the newly remade ETICS will be attacked, then it will be the danger to the health of the users of building. In our research, we have evaluated and verified sampling method for the characterization of biodeteriogens which are accessible and user friendly for public.
Název v anglickém jazyce
Characterisation of Microorganism from Individual Layers of the Building Envelope (ETICS) and Methods of Their Sampling
Popis výsledku anglicky
The current situation of contact insulation systems from 80s and 90s is fallback and they do not correspond with current valid technical norm. The almost case is necessary refurbishment of building envelope or performance of additional insulation. The question "what ETICS hides inside" occurs, and whether the removal is necessary or whether the making of additional insulation directly on the current one is possible. This is connected with occurring of growth microorganism especially mold through building envelope. Our article is about problem of mold through building envelope esp. ETICS in territory of Czech Republic. The results show that the whole ETICS is contaminated with mold and there is a risk that if there are appropriate conditions for the fungus in building envelope and the newly remade ETICS will be attacked, then it will be the danger to the health of the users of building. In our research, we have evaluated and verified sampling method for the characterization of biodeteriogens which are accessible and user friendly for public.
Klasifikace
Druh
D - Stať ve sborníku
CEP obor
JN - Stavebnictví
OECD FORD obor
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Návaznosti výsledku
Projekt
<a href="/cs/project/TA04010837" target="_blank" >TA04010837: Vývoj nových materiálů a technologií pro údržbu a rekonstrukci budov s aplikovanými kontaktními tepelně - izolačními systémy obvodových plášťů (ETICS)</a><br>
Návaznosti
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)
Ostatní
Rok uplatnění
2015
Kód důvěrnosti údajů
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Údaje specifické pro druh výsledku
Název statě ve sborníku
Proceedings of the 17th Conference on the Rehabilitation and Reconstruction of Buildings (CRRB 2015)
ISBN
978-3-03835-719-3
ISSN
1013-9826
e-ISSN
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Počet stran výsledku
5
Strana od-do
196-200
Název nakladatele
Trans Tech Publications
Místo vydání
Zurich
Místo konání akce
Praha
Datum konání akce
12. 11. 2015
Typ akce podle státní příslušnosti
WRD - Celosvětová akce
Kód UT WoS článku
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