Tin Whiskers - Reliability Risk For Electronic Equipment

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F09%3A00157761" target="_blank" >RIV/68407700:21230/09:00157761 - isvavai.cz</a>

Výsledek na webu

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DOI - Digital Object Identifier

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Jazyk výsledku

angličtina

Název v původním jazyce

Tin Whiskers - Reliability Risk For Electronic Equipment

Popis výsledku v původním jazyce

Unalloyed tin electroplating has a long history of whisker formation that has resulted in reliability risks for electronic equipment. Tin whiskers can grow between adjacent conductors of different potential, causing transient or permanent electrical shorts. In addition, the whiskers can break loose, causing mechanical damage in slip rings, optical components or MEMS. Legislation restriction of lead in electronic products sold in the European Union and many other areas of the world has resulted in removing lead from Sn/Pb plating and solder. Using pure tin represents reliability risks due to whisker forming tendencies of tin. The objective of our work is to investigate methods for whisker growth, which can further enable measuring the effectiveness of mitigation strategies. To achieve this objective, a set of experiments was conducted using bright and matte tin platings on brass and bronze coupons and hot-solder dipped bronze coupons.

Název v anglickém jazyce

Tin Whiskers - Reliability Risk For Electronic Equipment

Popis výsledku anglicky

Unalloyed tin electroplating has a long history of whisker formation that has resulted in reliability risks for electronic equipment. Tin whiskers can grow between adjacent conductors of different potential, causing transient or permanent electrical shorts. In addition, the whiskers can break loose, causing mechanical damage in slip rings, optical components or MEMS. Legislation restriction of lead in electronic products sold in the European Union and many other areas of the world has resulted in removing lead from Sn/Pb plating and solder. Using pure tin represents reliability risks due to whisker forming tendencies of tin. The objective of our work is to investigate methods for whisker growth, which can further enable measuring the effectiveness of mitigation strategies. To achieve this objective, a set of experiments was conducted using bright and matte tin platings on brass and bronze coupons and hot-solder dipped bronze coupons.

Druh

D - Stať ve sborníku

CEP obor

JA - Elektronika a optoelektronika, elektrotechnika

OECD FORD obor

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Projekt

<a href="/cs/project/OE229" target="_blank" >OE229: BESTPRODUCT- TENEEST Celoevropská síť environmentálního inženýrství</a><br>

Návaznosti

P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)

Rok uplatnění

2009

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

Umwelteinflüsse erfassen, simulieren, bewerten

ISBN

978-3-9810472-7-1

ISSN

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e-ISSN

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Počet stran výsledku

13

Strana od-do

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Název nakladatele

Gesellschaft für Umweltsimulation e.V.

Místo vydání

Pfinztal (Berghausen)

Místo konání akce

Stutensee-Blankenloch (Karlsruhe)

Datum konání akce

18. 3. 2009

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

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