Whisker Formation - Reliability Risk for Telecomunication Application

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F11%3A00181119" target="_blank" >RIV/68407700:21230/11:00181119 - isvavai.cz</a>

Výsledek na webu

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DOI - Digital Object Identifier

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Jazyk výsledku

angličtina

Název v původním jazyce

Whisker Formation - Reliability Risk for Telecomunication Application

Popis výsledku v původním jazyce

Tin whiskers are electrically conductive filaments that spontaneously grow on tin surfaces. The risk of whiskers does not present a big issue for consumer industry with shorter product`s lifecycle. On the other hand, due to the high reliability requirements of industrial applications such as telecommunication, whiskers have started to play the key role. This paper presents results of a case study, where the whisker formation was studied in detail on telecommunications equipment. The other part of this paper presents the results of experiments focused on the investigation of a method for a whisker. Methods for accelerated whisker growth are necessary for measuring the effectiveness of mitigation strategies. To achieve this, a set of experiments was conducted using tin platings on brass and bronze coupons and hot solder dipped bronze coupons. The experiments thus have shown the significant reliability risk for the devices containing pure tin platings layers and lead-free solders.

Název v anglickém jazyce

Whisker Formation - Reliability Risk for Telecomunication Application

Popis výsledku anglicky

Tin whiskers are electrically conductive filaments that spontaneously grow on tin surfaces. The risk of whiskers does not present a big issue for consumer industry with shorter product`s lifecycle. On the other hand, due to the high reliability requirements of industrial applications such as telecommunication, whiskers have started to play the key role. This paper presents results of a case study, where the whisker formation was studied in detail on telecommunications equipment. The other part of this paper presents the results of experiments focused on the investigation of a method for a whisker. Methods for accelerated whisker growth are necessary for measuring the effectiveness of mitigation strategies. To achieve this, a set of experiments was conducted using tin platings on brass and bronze coupons and hot solder dipped bronze coupons. The experiments thus have shown the significant reliability risk for the devices containing pure tin platings layers and lead-free solders.

Druh

D - Stať ve sborníku

CEP obor

JA - Elektronika a optoelektronika, elektrotechnika

OECD FORD obor

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Projekt

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Návaznosti

S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2011

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

Electronic Devices and Systems, IMAPS CS International Conference 2011 Proceedings

ISBN

978-80-214-4303-7

ISSN

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e-ISSN

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Počet stran výsledku

6

Strana od-do

33-38

Název nakladatele

VUT v Brně, FEKT

Místo vydání

Brno

Místo konání akce

Brno

Datum konání akce

22. 6. 2011

Typ akce podle státní příslušnosti

EUR - Evropská akce

Kód UT WoS článku

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