Influence of Reflow Temperature Profile on Properties of Soldered Joints

Kód výsledku v IS VaVaI

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Výsledek na webu

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DOI - Digital Object Identifier

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Jazyk výsledku

angličtina

Název v původním jazyce

Influence of Reflow Temperature Profile on Properties of Soldered Joints

Popis výsledku v původním jazyce

This article presents results of research aimed at the influence of manufacturing process of electronic device on creation and growth of intermetallic layers in the solder. These layers can significantly influence performance and reliability of the entire electronic device. Exact beahvior of intermetallic compounds under various conditions is not yet fully known - that is also one of the reasons sensitive devices for aerospace, medical or military industries are allowed to still use solders containing lead - and it is important to gain such knowledge, before the leadfree solders are allowed into such applications. To further this goal, this research compared both experimentally and theoretically various situations, that may be encountered during the electronic devices production.

Název v anglickém jazyce

Influence of Reflow Temperature Profile on Properties of Soldered Joints

Popis výsledku anglicky

This article presents results of research aimed at the influence of manufacturing process of electronic device on creation and growth of intermetallic layers in the solder. These layers can significantly influence performance and reliability of the entire electronic device. Exact beahvior of intermetallic compounds under various conditions is not yet fully known - that is also one of the reasons sensitive devices for aerospace, medical or military industries are allowed to still use solders containing lead - and it is important to gain such knowledge, before the leadfree solders are allowed into such applications. To further this goal, this research compared both experimentally and theoretically various situations, that may be encountered during the electronic devices production.

Druh

D - Stať ve sborníku

CEP obor

JA - Elektronika a optoelektronika, elektrotechnika

OECD FORD obor

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Projekt

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Návaznosti

Z - Vyzkumny zamer (s odkazem do CEZ)

Rok uplatnění

2009

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

Electronic Devices and Systems, IMAPS CS International Conference 2009 Proceedings

ISBN

978-80-214-3933-7

ISSN

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e-ISSN

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Počet stran výsledku

6

Strana od-do

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Název nakladatele

VUT v Brně, FEI

Místo vydání

Brno

Místo konání akce

Brno

Datum konání akce

2. 9. 2009

Typ akce podle státní příslušnosti

EUR - Evropská akce

Kód UT WoS článku

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