Long-Term Climatic Tests of Components for Electronics

Kód výsledku v IS VaVaI

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Výsledek na webu

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DOI - Digital Object Identifier

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Jazyk výsledku

angličtina

Název v původním jazyce

Long-Term Climatic Tests of Components for Electronics

Popis výsledku v původním jazyce

Current trends in electronic design and manufacture are often closely focused on the most crucial aspect of consumer electronics, which is attractive price. In such circumstances, longevity of electronic devices is not demanded or, indeed, desired - dueto short innovation cycle, consumer electronics technical life usually exceeds the moral life and thus little attention is paid to long-term reliability. This was also the reason why full implications of transfer to lead-free technology were often overlooked. However, recent experience shows that the results of transfer to lead-free soldering may be affecting negatively many areas where a long-term reliability is desired, especially if combined with adverse climatic conditions. This paper presents a comparison of two main lead-free technology branches, lead-free solders and electrically conductive adhesives, with regards to their long-term performance in both real and laboratory conditions.

Název v anglickém jazyce

Long-Term Climatic Tests of Components for Electronics

Popis výsledku anglicky

Current trends in electronic design and manufacture are often closely focused on the most crucial aspect of consumer electronics, which is attractive price. In such circumstances, longevity of electronic devices is not demanded or, indeed, desired - dueto short innovation cycle, consumer electronics technical life usually exceeds the moral life and thus little attention is paid to long-term reliability. This was also the reason why full implications of transfer to lead-free technology were often overlooked. However, recent experience shows that the results of transfer to lead-free soldering may be affecting negatively many areas where a long-term reliability is desired, especially if combined with adverse climatic conditions. This paper presents a comparison of two main lead-free technology branches, lead-free solders and electrically conductive adhesives, with regards to their long-term performance in both real and laboratory conditions.

Druh

D - Stať ve sborníku

CEP obor

JA - Elektronika a optoelektronika, elektrotechnika

OECD FORD obor

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Projekt

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Návaznosti

Z - Vyzkumny zamer (s odkazem do CEZ)

Rok uplatnění

2011

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

Electronic Devices and Systems, IMAPS CS International Conference 2011 Proceedings

ISBN

978-80-214-4303-7

ISSN

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e-ISSN

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Počet stran výsledku

4

Strana od-do

91-94

Název nakladatele

VUT v Brně, FEKT

Místo vydání

Brno

Místo konání akce

Brno

Datum konání akce

22. 6. 2011

Typ akce podle státní příslušnosti

EUR - Evropská akce

Kód UT WoS článku

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