The Conductive Adhesive Joins under Thermal Shock

Kód výsledku v IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F11%3A00183836" target="_blank" >RIV/68407700:21230/11:00183836 - isvavai.cz</a>
Výsledek na webu
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Jazyk výsledku
angličtina
Název v původním jazyce
The Conductive Adhesive Joins under Thermal Shock
Popis výsledku v původním jazyce
The work is focused on joins realised by electrically conductive adhesives. Lower curing temperature is main advantage of adhesives. But electrical and mechanical parameters are worse than for solders. The influence of thermal shocks on properties of joins realized by electrically conductive adhesives were analyzed. The temperature during thermal ageing is changed from room temperature to temperature below freezing point. Electrical resistance and non-linearity of current voltage characteristic were measured. Mechanical strength was measured too.
Název v anglickém jazyce
The Conductive Adhesive Joins under Thermal Shock
Popis výsledku anglicky
The work is focused on joins realised by electrically conductive adhesives. Lower curing temperature is main advantage of adhesives. But electrical and mechanical parameters are worse than for solders. The influence of thermal shocks on properties of joins realized by electrically conductive adhesives were analyzed. The temperature during thermal ageing is changed from room temperature to temperature below freezing point. Electrical resistance and non-linearity of current voltage characteristic were measured. Mechanical strength was measured too.

Rok uplatnění
2011
Kód důvěrnosti údajů
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

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