Influence of Humidity on Voids Formation Inside the Solder Joint

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F12%3A00200415" target="_blank" >RIV/68407700:21230/12:00200415 - isvavai.cz</a>

Nalezeny alternativní kódy

RIV/68407700:21230/13:00213097

Výsledek na webu

<a href="http://dms.fzu.cz/22/printables/absbook.pdf" target="_blank" >http://dms.fzu.cz/22/printables/absbook.pdf</a>

DOI - Digital Object Identifier

—

Jazyk výsledku

angličtina

Název v původním jazyce

Influence of Humidity on Voids Formation Inside the Solder Joint

Popis výsledku v původním jazyce

Article deals with influence of humidity on voids formation inside the solder joint. Experimental part was carried on testing samples, where we used three types of solder pastes (Sn62Pb36Ag2, Sn96.5Ag3Cu0.5 and Sn95.5Ag4Cu0.5), three types of reflow technology (hot air, vapor phase and infra radiation) and three types of humidity environments. PCB together with SMD resistors, were placed in three different types of humidity environments (dry - humidity was less than 5%, ambient - average humidity was around 60 % and humid environment - 100 % humidity) for 500 hours. After that we took the components from environments and we prepared samples - the solder paste was applied on the solder pads using a screen printing process, components were placed on PCBand then the solder paste was reflowed. The inspection was made on X-Ray and following diagnostic was made by image analysis with special software. We evaluate the number of voids together with their total area of all voids inside each so

Název v anglickém jazyce

Influence of Humidity on Voids Formation Inside the Solder Joint

Popis výsledku anglicky

Article deals with influence of humidity on voids formation inside the solder joint. Experimental part was carried on testing samples, where we used three types of solder pastes (Sn62Pb36Ag2, Sn96.5Ag3Cu0.5 and Sn95.5Ag4Cu0.5), three types of reflow technology (hot air, vapor phase and infra radiation) and three types of humidity environments. PCB together with SMD resistors, were placed in three different types of humidity environments (dry - humidity was less than 5%, ambient - average humidity was around 60 % and humid environment - 100 % humidity) for 500 hours. After that we took the components from environments and we prepared samples - the solder paste was applied on the solder pads using a screen printing process, components were placed on PCBand then the solder paste was reflowed. The inspection was made on X-Ray and following diagnostic was made by image analysis with special software. We evaluate the number of voids together with their total area of all voids inside each so

Druh

O - Ostatní výsledky

CEP obor

JA - Elektronika a optoelektronika, elektrotechnika

OECD FORD obor

—

Projekt

—

Návaznosti

S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2013

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů