Study of the components self-alignment in surface mount technology

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216208%3A11320%2F12%3A10129397" target="_blank" >RIV/00216208:11320/12:10129397 - isvavai.cz</a>

Výsledek na webu

<a href="http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6273138" target="_blank" >http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6273138</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1109/ISSE.2012.6273138" target="_blank" >10.1109/ISSE.2012.6273138</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Study of the components self-alignment in surface mount technology

Popis výsledku v původním jazyce

The operator or pick and place machine sometimes place the component on its position with a small shift. It isn't a critical mistake, because it is a well known phenomenon that during the time when the solder paste is in liquid state the wetting force that acts on components shifts the component to the correct (straight) position according to the soldering pads. This article deals with study of SMD components self-alignment in surface mount technology. In this article, the component self-alignment withregard to different types of solders, different types of reflow technology, different solder paste volume and different component placement angles was observed. In our experiments three types of solders - one leaded (Sn62/Pb36/Ag2) and two lead-free (Sn99,25/Cu0,7/Ni0,05 and Sn95,5/Ag4/Cu0,5) and two types of reflow technologies (hot air soldering and vapor phase soldering) were used.

Název v anglickém jazyce

Study of the components self-alignment in surface mount technology

Popis výsledku anglicky

The operator or pick and place machine sometimes place the component on its position with a small shift. It isn't a critical mistake, because it is a well known phenomenon that during the time when the solder paste is in liquid state the wetting force that acts on components shifts the component to the correct (straight) position according to the soldering pads. This article deals with study of SMD components self-alignment in surface mount technology. In this article, the component self-alignment withregard to different types of solders, different types of reflow technology, different solder paste volume and different component placement angles was observed. In our experiments three types of solders - one leaded (Sn62/Pb36/Ag2) and two lead-free (Sn99,25/Cu0,7/Ni0,05 and Sn95,5/Ag4/Cu0,5) and two types of reflow technologies (hot air soldering and vapor phase soldering) were used.

Druh

J_x - Nezařazeno - Článek v odborném periodiku (Jimp, Jsc a Jost)

CEP obor

BM - Fyzika pevných látek a magnetismus

OECD FORD obor

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Projekt

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Návaznosti

Z - Vyzkumny zamer (s odkazem do CEZ)<br>I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Rok uplatnění

2012

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název periodika

IEEE Xplore - 2012 35th International Spring Seminar on Electronics Technology (ISSE)

ISSN

2161-2528

e-ISSN

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Svazek periodika

Neuveden

Číslo periodika v rámci svazku

srpen

Stát vydavatele periodika

AT - Rakouská republika

Počet stran výsledku

4

Strana od-do

197-200

Kód UT WoS článku

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EID výsledku v databázi Scopus

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