Methods of Accelerated Growth of Tin Whiskers

Kód výsledku v IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F12%3A00204810" target="_blank" >RIV/68407700:21230/12:00204810 - isvavai.cz</a>
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Jazyk výsledku
angličtina
Název v původním jazyce
Methods of Accelerated Growth of Tin Whiskers
Popis výsledku v původním jazyce
Unalloyed tin electroplating has a long history of whisker formation that has resulted in present reliability risks for electronic equipment. Tin whiskers can grow between adjacent conductors of different potential, causing transient or permanent electrical shorts. In addition, the whiskers can break loose, causing mechanical damage in slip rings, optical components or MEMS. The objective of our work is to investigate methods for tin whisker growth, which can further enable measuring the effectiveness of mitigation strategies.
Název v anglickém jazyce
Methods of Accelerated Growth of Tin Whiskers
Popis výsledku anglicky
Unalloyed tin electroplating has a long history of whisker formation that has resulted in present reliability risks for electronic equipment. Tin whiskers can grow between adjacent conductors of different potential, causing transient or permanent electrical shorts. In addition, the whiskers can break loose, causing mechanical damage in slip rings, optical components or MEMS. The objective of our work is to investigate methods for tin whisker growth, which can further enable measuring the effectiveness of mitigation strategies.

Rok uplatnění
2012
Kód důvěrnosti údajů
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Podobné výsledky(10)