Design methodologies for reliability of SSL LED boards

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F13%3A00205480" target="_blank" >RIV/68407700:21230/13:00205480 - isvavai.cz</a>

Výsledek na webu

<a href="http://www.sciencedirect.com/science/article/pii/S0026271413000930" target="_blank" >http://www.sciencedirect.com/science/article/pii/S0026271413000930</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1016/j.microrel.2013.02.017" target="_blank" >10.1016/j.microrel.2013.02.017</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Design methodologies for reliability of SSL LED boards

Popis výsledku v původním jazyce

This work presents a comparison of various LED board technologies from thermal, mechanical and reliability point of view provided by an accurate 3-D modelling. LED boards are proposed as a possible technology replacement of FR4 LED boards used in 400 lumen retrofit SSL lamps. Presented design methodology can be used for other high power SSL lamp designs. The performance of new LED board designs were evaluated by numerical modeling. Modeling methodology was proven by measurement on reference FR4 LED board. Thermal performance was compared by extracting of LED boards thermal resistances and thermal stress has been inspected considering the widest temperature operating range according to standards (-40 to +125 °C). Thermo-mechanical and reliability analysis have been performed to study parameters of each LED board technology, using thermal boundary conditions extracted from the thermal simulation of a whole LED lamp. Elastic-plastic analysis with temperature dependent stress-strain materi

Název v anglickém jazyce

Design methodologies for reliability of SSL LED boards

Popis výsledku anglicky

This work presents a comparison of various LED board technologies from thermal, mechanical and reliability point of view provided by an accurate 3-D modelling. LED boards are proposed as a possible technology replacement of FR4 LED boards used in 400 lumen retrofit SSL lamps. Presented design methodology can be used for other high power SSL lamp designs. The performance of new LED board designs were evaluated by numerical modeling. Modeling methodology was proven by measurement on reference FR4 LED board. Thermal performance was compared by extracting of LED boards thermal resistances and thermal stress has been inspected considering the widest temperature operating range according to standards (-40 to +125 °C). Thermo-mechanical and reliability analysis have been performed to study parameters of each LED board technology, using thermal boundary conditions extracted from the thermal simulation of a whole LED lamp. Elastic-plastic analysis with temperature dependent stress-strain materi

Druh

J_x - Nezařazeno - Článek v odborném periodiku (Jimp, Jsc a Jost)

CEP obor

JA - Elektronika a optoelektronika, elektrotechnika

OECD FORD obor

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Projekt

<a href="/cs/project/7H10017" target="_blank" >7H10017: Consumerizing Solid State Lighting</a><br>

Návaznosti

P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2013

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název periodika

Microelectronics Reliability

ISSN

0026-2714

e-ISSN

—

Svazek periodika

53

Číslo periodika v rámci svazku

8

Stát vydavatele periodika

NL - Nizozemsko

Počet stran výsledku

8

Strana od-do

1076-1083

Kód UT WoS článku

000322292100005

EID výsledku v databázi Scopus

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