Design for reliability of solid state lighting systems

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F12%3A00195116" target="_blank" >RIV/68407700:21230/12:00195116 - isvavai.cz</a>

Výsledek na webu

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DOI - Digital Object Identifier

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Jazyk výsledku

angličtina

Název v původním jazyce

Design for reliability of solid state lighting systems

Popis výsledku v původním jazyce

This work presents a methodology to design an SSL system for reliability. An LED lamp is thermally characterised and its model thermally simulated, indicating that the LED board (FR4 board with thermal vias, copper tracks and LED package) is the thermally most stressed part. Therefore, a thermo-mechanical analysis is performed from a detailed LED board model to study reliability and lifetime limits, using thermal boundary conditions deduced from the thermal simulation of the whole LED lamp. Based on this analysis the weakest spots are identified as the metal vias in the LED package and the interconnection area between the LED package and copper tracks on the FR4 board.

Název v anglickém jazyce

Design for reliability of solid state lighting systems

Popis výsledku anglicky

This work presents a methodology to design an SSL system for reliability. An LED lamp is thermally characterised and its model thermally simulated, indicating that the LED board (FR4 board with thermal vias, copper tracks and LED package) is the thermally most stressed part. Therefore, a thermo-mechanical analysis is performed from a detailed LED board model to study reliability and lifetime limits, using thermal boundary conditions deduced from the thermal simulation of the whole LED lamp. Based on this analysis the weakest spots are identified as the metal vias in the LED package and the interconnection area between the LED package and copper tracks on the FR4 board.

Druh

J_x - Nezařazeno - Článek v odborném periodiku (Jimp, Jsc a Jost)

CEP obor

JA - Elektronika a optoelektronika, elektrotechnika

OECD FORD obor

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Projekt

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Návaznosti

R - Projekt Ramcoveho programu EK

Rok uplatnění

2012

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název periodika

Microelectronics Reliability

ISSN

0026-2714

e-ISSN

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Svazek periodika

9-10

Číslo periodika v rámci svazku

52

Stát vydavatele periodika

NL - Nizozemsko

Počet stran výsledku

7

Strana od-do

2294-2300

Kód UT WoS článku

000309785400106

EID výsledku v databázi Scopus

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